TAS5729MD

TAS5729MD


Specifications
SKU
12611427
Details

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Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VDD 4.5 5 5.5 V
Standby Current ISB - 10 - mA Standby mode
Quiescent Current IQ - 30 - mA Active mode
Output Power (8惟, THD=1%) POUT - 25 - W Per channel, BTL configuration
Efficiency - 90 - % At full power, 8惟 load
Signal-to-Noise Ratio SNR - 105 - dB A-weighted, 20Hz to 20kHz
Total Harmonic Distortion THD+N - 0.05 - % 1kHz, full scale
Input Sensitivity VIN - 1 - Vpp Differential input
Input Impedance ZIN - 20 - k惟 Differential input
Operating Temperature Range Toper -40 - 85 掳C
Storage Temperature Range Tstg -65 - 150 掳C

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 4.5V to 5.5V.
    • Use a stable power supply to avoid voltage fluctuations that can affect performance.
  2. Standby Mode:

    • To enter standby mode, set the appropriate control pin to a low state.
    • The standby current (ISB) is typically around 10mA.
  3. Active Mode:

    • In active mode, the quiescent current (IQ) is approximately 30mA.
    • Ensure proper heat dissipation if operating at high output power levels.
  4. Output Configuration:

    • For optimal performance, configure the amplifier in a Bridge-Tied Load (BTL) configuration for 8惟 loads.
    • The maximum output power per channel is 25W with less than 1% THD.
  5. Signal Quality:

    • The signal-to-noise ratio (SNR) is 105dB, ensuring a clean audio signal.
    • The total harmonic distortion plus noise (THD+N) is 0.05% at 1kHz, providing high-fidelity sound.
  6. Input Handling:

    • The differential input sensitivity (VIN) is 1Vpp.
    • The input impedance (ZIN) is 20k惟, suitable for most audio sources.
  7. Temperature Considerations:

    • The operating temperature range (Toper) is from -40掳C to 85掳C.
    • The storage temperature range (Tstg) is from -65掳C to 150掳C.
  8. Protection Features:

    • The device includes thermal shutdown and short-circuit protection to ensure reliable operation.
  9. Layout and Mounting:

    • Follow recommended PCB layout guidelines to minimize electromagnetic interference (EMI).
    • Ensure proper mounting and cooling to maintain performance and longevity.
  10. Testing and Verification:

    • Test the device with a known good audio source and load to verify correct operation.
    • Monitor temperature and current draw during testing to ensure the device is functioning within specifications.
(For reference only)

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