Details

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BUY HD74S04P https://www.utsource.net/itm/p/12611524.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	4.75	5.0	5.25	V
Input Low Voltage	VIL	-	0	-	1.5	V
Input High Voltage	VIH	-	3.5	-	5.25	V
Output Low Voltage	VOL	IOL = 16 mA	0	-	0.5	V
Output High Voltage	VOH	IOH = -0.4 mA	2.7	-	5.25	V
Propagation Delay Time (Typical)	tpd	VCC = 5V, TA = 25掳C	-	22	-	ns
Power Dissipation	PD	-	-	-	100	mW
Operating Temperature Range	TA	-	-40	-	85	掳C
Storage Temperature Range	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 4.75V to 5.25V to avoid damage to the device.

2. Input Voltages (V_IL, V_IH):

   • Inputs should be below 1.5V for a low logic level and above 3.5V for a high logic level to ensure reliable operation.

3. Output Voltages (V_OL, V_OH):

   • The output low voltage should not exceed 0.5V when sourcing 16mA.
   • The output high voltage should be at least 2.7V when sinking -0.4mA.

4. Propagation Delay Time (t_pd):

   • The typical propagation delay time is 22ns under standard conditions (V_CC = 5V, T_A = 25掳C).

5. Power Dissipation (P_D):

   • The maximum power dissipation should not exceed 100mW to prevent overheating.

6. Operating Temperature (T_A):

   • The device can operate within a temperature range of -40掳C to 85掳C.

7. Storage Temperature (T_STG):

   • Store the device in a temperature range of -65掳C to 150掳C to ensure long-term reliability.

8. Handling:

   • Handle with care to avoid static discharge and physical damage.
   • Follow proper soldering techniques to avoid thermal stress.

9. Mounting:

   • Ensure proper mounting on the PCB to maintain electrical and mechanical integrity.
   • Use appropriate heat sinks if necessary to manage thermal dissipation.

10. Testing:

    • Test the device under specified conditions to verify its performance and functionality.

(For reference only)