Details
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| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| VCC | Supply Voltage | 2.0 | - | 5.5 | V |
| ICC | Supply Current | - | 100 | 300 | 渭A |
| VIN | Input Voltage | 0.3 | - | VCC - 0.3 | V |
| VOUT | Output Voltage | 0.0 | - | VCC - 0.3 | V |
| IOUT | Output Current | - | 50 | 100 | mA |
| RON | On-State Resistance | - | 1.5 | 2.5 | 惟 |
| td | Delay Time | 0.1 | 0.5 | 1.0 | 渭s |
| tr | Rise Time | 0.1 | 0.5 | 1.0 | 渭s |
| tf | Fall Time | 0.1 | 0.5 | 1.0 | 渭s |
| VIH | Input High Voltage | 0.7 * VCC | - | VCC | V |
| VIL | Input Low Voltage | 0 | - | 0.3 * VCC | V |
| Tj | Junction Temperature | -40 | - | 125 | 掳C |
Instructions for Use
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 2.0V to 5.5V.
- Connect the positive terminal of the power supply to VCC and the negative terminal to GND.
Input Voltage (VIN):
- The input voltage should be between 0.3V and (VCC - 0.3V).
- Apply the control signal to VIN to turn the device on or off.
Output Voltage (VOUT):
- The output voltage will be between 0V and (VCC - 0.3V) when the device is on.
- Ensure the load connected to VOUT does not exceed the maximum output current.
Output Current (IOUT):
- The device can provide up to 100mA of output current.
- Do not exceed this limit to avoid damage to the device.
On-State Resistance (RON):
- The on-state resistance is typically 1.5惟 and can vary between 1.5惟 and 2.5惟.
- This resistance affects the power dissipation and efficiency of the device.
Timing Parameters:
- Delay Time (td): The time from the application of the input signal to the start of the output transition.
- Rise Time (tr): The time for the output voltage to rise from 10% to 90% of its final value.
- Fall Time (tf): The time for the output voltage to fall from 90% to 10% of its initial value.
Input Signal Levels:
- Input High Voltage (VIH): The minimum voltage required to recognize the input as high is 0.7 * VCC.
- Input Low Voltage (VIL): The maximum voltage recognized as low is 0.3 * VCC.
Junction Temperature (Tj):
- The junction temperature should not exceed 125掳C.
- Ensure proper heat sinking if operating at high temperatures or under high load conditions.
Handling Precautions:
- Handle the device with care to avoid static discharge.
- Follow proper soldering techniques to ensure reliable connections.
Storage Conditions:
- Store the device in a dry, cool place away from direct sunlight.
- Avoid exposure to extreme temperatures and humidity.
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