Details
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| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Input Voltage | VIN | 4.5 | - | 40 | V |
| Output Voltage | VOUT | 1.23 | - | 38 | V |
| Output Current | IOUT | - | - | 3 | A |
| Switching Frequency | fSW | - | 160 | 600 | kHz |
| Quiescent Current | IQ | - | 1.2 | - | mA |
| Shutdown Current | ISD | - | 0.1 | - | 渭A |
| Operating Temperature | TOPR | -40 | - | 85 | 掳C |
| Storage Temperature | TSTG | -55 | - | 150 | 掳C |
Instructions for XLSEMI XL2596S-12E1:
Input Voltage Setup:
- Ensure the input voltage is within the range of 4.5V to 40V.
- Use appropriate decoupling capacitors (typically 10渭F) close to the input pins.
Output Voltage Adjustment:
- The output voltage can be adjusted using external resistors connected to the feedback pin.
- Follow the formula provided in the datasheet for calculating resistor values.
Output Current Limitation:
- The device can provide up to 3A of output current, depending on the heat dissipation and load conditions.
- Consider adding heatsinks or ensuring adequate airflow if operating at high currents.
Switching Frequency Configuration:
- The switching frequency can be set between 160kHz and 600kHz using an external resistor connected to the RT pin.
Quiescent Current Management:
- The quiescent current is typically 1.2mA. Keep this in mind for low-power applications.
Shutdown Operation:
- To place the device into shutdown mode, pull the EN pin low. The shutdown current is approximately 0.1渭A.
Thermal Considerations:
- Operate within the temperature range of -40掳C to 85掳C for optimal performance.
- Store the device in environments ranging from -55掳C to 150掳C.
PCB Layout Recommendations:
- Place all components as close as possible to minimize parasitic inductance and resistance.
- Ensure proper grounding and shielding to reduce electromagnetic interference.
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