HN58C256AP-10

HN58C256AP-10


Specifications
Details

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Parameter Description Value
Device Type CMOS Low Power Static RAM 256K x 8
Package Type SOP (Small Outline Package) 28-Pin
Supply Voltage Range Operating voltage range 2.7V to 3.6V
Standby Current Current consumption in standby mode 1 渭A max
Active Current Current consumption during active operation 50 mA max
Access Time Time required for read/write operations 10 ns max
Data Retention Time Duration data is retained without power 10 years min
Operating Temperature Temperature range for reliable operation -40掳C to +85掳C
Storage Temperature Temperature range for storage -55掳C to +125掳C
Write Cycle Time Minimum time between write operations 15 ns max
Organization Internal memory organization 32K x 8

Instructions:

  1. Power Supply Connection: Connect the VCC pin to a stable power supply within the specified voltage range (2.7V to 3.6V). Ensure the GND pin is properly grounded.
  2. Signal Integrity: Maintain clean signal lines for address, data, and control signals to avoid data corruption.
  3. Operating Environment: Operate within the specified temperature range (-40掳C to +85掳C) to ensure reliable performance.
  4. Handling Precautions: Handle with care to prevent electrostatic discharge (ESD) damage; use appropriate ESD protection measures.
  5. Write Operations: Ensure sufficient time between write cycles as per the write cycle time specification (15 ns max).
  6. Standby Mode: To minimize power consumption, put the device into standby mode when not in use.
  7. Storage Conditions: When storing, keep within the storage temperature range (-55掳C to +125掳C) and avoid exposure to excessive humidity or corrosive environments.
  8. Installation: Install the device on a suitable PCB with proper thermal management considerations if operating near the upper temperature limit.
(For reference only)

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