Details

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BUY FMG33S https://www.utsource.net/itm/p/12611725.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	Vcc	2.0	3.3	5.5	V	Operating voltage range
Operating Current	Iop	-	1.5	2.5	mA	Current consumption at typical operation
Output Frequency	fO	30	33	36	kHz	Nominal output frequency
Frequency Stability	Δf/fO	-	±50	-	ppm	Stability over temperature and time
Load Capacitance	CL	10	20	30	pF	External load capacitance for optimal performance
Operating Temperature	Topr	-40	-	85	°C	Range of ambient temperatures
Storage Temperature	Tstg	-55	-	125	°C	Range of storage temperatures
Shock Resistance	-	-	5000	-	g	Mechanical shock resistance
Vibration Resistance	-	-	20	-	g (10-2000Hz)	Mechanical vibration resistance
Mounting Orientation	-	-	-	-	-	Horizontal or vertical
Package Type	-	-	-	-	SMD	Surface mount device
Dimensions	-	-	3.2 x 2.5 x 1.0	-	mm (LxWxH)	Physical dimensions

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage is within the specified range (2.0V to 5.5V).
   • Use a stable power source to avoid fluctuations that can affect performance.

2. Load Capacitance:

   • Connect external load capacitors of 20pF (nominal value) to achieve optimal frequency stability.
   • Adjust the load capacitance if necessary to fine-tune the output frequency.

3. Frequency Stability:

   • The frequency stability is ±50ppm over the operating temperature range. For critical applications, consider using temperature compensation techniques.

4. Operating Temperature:

   • Operate the device within the temperature range of -40°C to 85°C to ensure reliable performance.
   • Avoid exposing the device to extreme temperatures outside this range.

5. Storage Temperature:

   • Store the device in an environment with temperatures between -55°C and 125°C to prevent damage.

6. Mechanical Considerations:

   • The device can withstand mechanical shocks up to 5000g and vibrations up to 20g (10-2000Hz).
   • Mount the device either horizontally or vertically as per the application requirements.

7. Mounting:

   • Use surface mount technology (SMD) for mounting the device.
   • Follow standard reflow soldering profiles to ensure proper attachment and avoid thermal stress.

8. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Use appropriate ESD protection measures during handling and assembly.

9. Testing:

   • Test the device under controlled conditions to verify its performance parameters.
   • Use a frequency counter to measure the output frequency and ensure it meets the specifications.

10. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific guidelines for your application.

(For reference only)