Details

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BUY 2SK2313 https://www.utsource.net/itm/p/12611762.html

Parameter	Symbol	Value	Unit
Drain-to-Source Voltage	V(DS)	450	V
Gate-to-Source Voltage	V(GS)	卤20	V
Continuous Drain Current	I(D)	10	A
Pulse Drain Current	I(DM)	20	A
Power Dissipation	P(TOT)	120	W
Junction Temperature	T(J)	-55 to +150	掳C
Storage Temperature	T(STG)	-55 to +150	掳C

Instructions for Use:

1. Handling Precautions:

   • Avoid exposing the device to temperatures outside the specified range.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure good thermal contact between the device and the heat sink.
   • Use a suitable thermal compound to enhance heat dissipation.

3. Biasing:

   • Apply the gate-to-source voltage (V(GS)) carefully to avoid exceeding the maximum ratings.
   • Ensure that the drain-to-source voltage (V(DS)) does not exceed 450V.

4. Operation:

   • Operate the device within its continuous and pulse current ratings to prevent overheating and damage.
   • Monitor the junction temperature (T(J)) to ensure it remains within the safe operating range.

5. Storage:

   • Store the device in a dry, cool place away from direct sunlight and extreme temperatures.

6. Testing:

   • Use appropriate test equipment and follow safety guidelines to avoid damaging the device during testing.

7. Soldering:

   • Solder the device quickly to avoid excessive heat buildup, which can damage the internal structure.
   • Follow the recommended soldering profile provided by the manufacturer.

(For reference only)