Details
BUY 2SK851 https://www.utsource.net/itm/p/12611788.html
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Drain-Source Voltage | Vds | - | 450 | V | |
| Gate-Source Voltage | Vgs | -20 | 10 | V | |
| Continuous Drain | Id | - | 10 | 12 | A |
| Pulse Drain | Idm | - | 20 | 24 | A |
| Power Dissipation | Ptot | - | 120 | W | |
| Junction Temperature | Tj | - | 175 | 掳C | |
| Storage Temperature | Tstg | -55 | 150 | 掳C |
Instructions for Use:
Handling Precautions:
- Avoid exceeding the maximum ratings to prevent damage.
- Use proper ESD (Electrostatic Discharge) protection when handling the device.
Mounting:
- Ensure good thermal management by using appropriate heat sinks.
- Follow recommended PCB layout guidelines for optimal performance and reliability.
Biasing:
- Apply gate-source voltage (Vgs) within the specified range to control the drain current (Id).
- Ensure the gate is properly biased to avoid excessive power dissipation.
Operation:
- Operate the device within the specified temperature range to ensure reliable performance.
- Monitor the junction temperature to prevent overheating.
Testing:
- Use recommended test conditions for accurate characterization.
- Refer to the datasheet for detailed test procedures and conditions.
Storage:
- Store the device in a dry, cool environment to prevent moisture damage.
- Keep the device in its original packaging until ready for use.
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