Details
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| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Drain-to-Source Voltage | V(DS) | 450 | V |
| Gate-to-Source Voltage | V(GS) | 卤20 | V |
| Drain Current | I(D) | 12 | A |
| Gate Threshold Voltage | V(GS(th)) | 2.0 to 4.0 | V |
| Input Capacitance | Ciss | 2200 | pF |
| Output Capacitance | Coss | 370 | pF |
| Reverse Transfer Capacitance | Crss | 260 | pF |
| Maximum Power Dissipation | P(TOT) | 180 | W |
| Junction Temperature | T(j) | -55 to 150 | 掳C |
| Storage Temperature | T(stg) | -55 to 150 | 掳C |
Instructions for Use:
Handling Precautions:
- Avoid applying voltages exceeding the maximum ratings.
- Handle the device with care to avoid mechanical damage.
- Use appropriate ESD (Electrostatic Discharge) protection when handling the device.
Mounting and Soldering:
- Ensure proper heat sinking to manage the power dissipation.
- Follow recommended soldering profiles to avoid thermal shock.
- Use a heatsink or cooling solution if operating at high power levels.
Biasing and Operation:
- Apply the gate voltage within the specified range to ensure reliable operation.
- Monitor the drain current to prevent exceeding the maximum current rating.
- Ensure the junction temperature remains within the specified limits.
Storage:
- Store the device in a dry, cool place to prevent moisture damage.
- Keep the device away from direct sunlight and extreme temperatures.
Testing:
- Use a suitable test setup to verify the device parameters.
- Refer to the datasheet for detailed testing procedures and conditions.
Application Notes:
- The 2SK2508 is suitable for high-frequency switching applications and power amplifiers.
- For optimal performance, consult application notes and design guidelines provided by the manufacturer.
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