Details

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BUY MUR1620 https://www.utsource.net/itm/p/12611873.html

Parameter	Symbol	Value	Unit
Maximum Repetitive Peak Reverse Voltage	VRRM	1600	V
Maximum RMS Voltage	VRMS	1130	V
Maximum DC Blocking Voltage	VDC	1400	V
Maximum Average Rectified Forward Current (Tc = 75掳C)	IF(AV)	20	A
Maximum RMS Current (Tc = 75掳C)	IRMS	28.3	A
Peak Surge Current (tp = 10 ms, sin ? wave)	IFSM	100	A
Junction Temperature Range	TJ	-55 to +150	掳C
Storage Temperature Range	TSTG	-55 to +150	掳C
Operating Temperature Range	TOPR	-55 to +150	掳C
Forward Voltage Drop at IF = 20A	VF	1.1	V
Reverse Recovery Time	trr	75	ns

Instructions for Use:

1. Voltage Ratings:

   • Ensure that the maximum repetitive peak reverse voltage (VRRM) does not exceed 1600V.
   • The maximum DC blocking voltage (VDC) should not exceed 1400V.
   • The maximum RMS voltage (VRMS) should be kept below 1130V.

2. Current Ratings:

   • The maximum average rectified forward current (IF(AV)) is 20A at a case temperature (Tc) of 75掳C.
   • The maximum RMS current (IRMS) is 28.3A at the same case temperature.
   • For surge conditions, the peak surge current (IFSM) can reach up to 100A for a pulse duration of 10 ms (sin ? wave).

3. Temperature Considerations:

   • The junction temperature (TJ) should be maintained between -55掳C and +150掳C.
   • The storage temperature range (TSTG) is also -55掳C to +150掳C.
   • The operating temperature range (TOPR) is the same as the junction and storage temperatures.

4. Forward Voltage Drop:

   • At a forward current (IF) of 20A, the forward voltage drop (VF) is typically 1.1V.

5. Reverse Recovery Time:

   • The reverse recovery time (trr) is 75 nanoseconds.

6. Mounting and Handling:

   • Handle the device with care to avoid mechanical damage.
   • Ensure proper heat sinking if operating at high currents or in high-temperature environments.

7. Electrostatic Discharge (ESD) Protection:

   • Use appropriate ESD protection measures during handling and assembly to prevent damage to the device.

8. Soldering:

   • Follow recommended soldering profiles to avoid thermal shock and ensure reliable connections.

9. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.

10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your application.

(For reference only)