Details

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BUY TIC106D https://www.utsource.net/itm/p/12611891.html

Parameter	Symbol	Min	Typ	Max	Unit
Repetitive Peak Off-State Voltage	VDRM	400	-	600	V
Repetitive Peak Reverse Voltage	VRSM	400	-	600	V
Non-Repetitive Peak Off-State Voltage	VD(RMS)	550	-	750	V
Non-Repetitive Peak Reverse Voltage	VRS(RMS)	550	-	750	V
RMS On-State Current (Tj = 25掳C)	IT(RMS)	-	10	-	A
Average On-State Current (Tj = 100掳C)	IT(AV)	-	8	-	A
Maximum RMS Gate Current	IG(RMS)	-	0.5	-	A
Maximum Surge Current (Half Sine Wave, 10 ms)	ITSM	-	50	-	A
Gate Trigger Voltage (Tj = 25掳C)	VGT	1.5	2.5	3.5	V
Gate Trigger Current (Tj = 25掳C)	IGT	50	100	150	mA
Holding Current	IH	5	-	25	mA
On-State Voltage Drop (IT = 10 A, Tj = 25掳C)	VTM	-	1.5	-	V
Junction Temperature Range	Tj	-40	-	125	掳C
Storage Temperature Range	Tstg	-40	-	125	掳C

Instructions for Use:

1. Mounting:

   • Ensure the TIC106D is securely mounted to a heatsink to maintain optimal operating temperatures.
   • Use thermal paste between the device and the heatsink to improve heat dissipation.

2. Gate Drive:

   • Apply a gate trigger voltage (V_GT) within the specified range to turn on the device.
   • Ensure the gate trigger current (I_GT) is sufficient to reliably turn on the device.

3. Current Handling:

   • Do not exceed the maximum RMS on-state current (I_T(RMS)) or average on-state current (I_T(AV)) ratings.
   • For surge currents, ensure they do not exceed the non-repetitive peak values (I_TSM).

4. Voltage Ratings:

   • Ensure that the off-state and reverse voltages do not exceed the repetitive peak (V_DRM, V_RSM) or non-repetitive peak (V_D(RMS), V_RS(RMS)) ratings.

5. Temperature Management:

   • Monitor the junction temperature (T_j) to ensure it stays within the specified range.
   • Store the device in an environment where the storage temperature (T_stg) does not exceed the limits.

6. Holding Current:

   • Ensure the holding current (I_H) is maintained to keep the device in the on state.

7. Testing:

   • Before deploying the device in a final application, perform thorough testing to ensure all parameters are within the specified limits and the device operates as expected.

8. Handling:

   • Handle the device with care to avoid mechanical damage or static discharge, which can affect performance.

(For reference only)