Details

---

BUY ADG408BN https://www.utsource.net/itm/p/12611893.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VDD)	Operating supply voltage range	2.7	-	15	V
Quiescent Current (IQ)	Supply current with no switches active	-	60	-	渭A
On-Resistance (RON)	Resistance when switch is on, typical at VDD = 5V	-	3.5	-	惟
Leakage Current (ILK)	Maximum leakage current through switch when off	-	-	100	nA
Input Signal Range	Input signal range relative to supply rails	-0.3	-	VDD + 0.3	V
Switching Time (tON, tOFF)	Time for switch to turn on or off	-	1	-	渭s
Storage Temperature (TSTG)	Temperature range for storage	-65	-	150	掳C
Operating Temperature (TOPR)	Temperature range for operation	-40	-	85	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the specified range of 2.7V to 15V.
   • Connect the VDD pin to the positive supply and GND pin to the ground.

2. Signal Input:

   • The input signal should be within the range of -0.3V to VDD + 0.3V to avoid damaging the device.

3. Switch Control:

   • Use the control inputs (IN1 to IN8) to select which channel is connected to the common output (COM).
   • Apply a logic high (VDD) to the control input to turn the corresponding switch on, and a logic low (GND) to turn it off.

4. Quiescent Current:

   • The quiescent current is typically 60 渭A when no switches are active. Ensure this is accounted for in your power budget.

5. On-Resistance:

   • The on-resistance (RON) is typically 3.5 惟 at VDD = 5V. Consider this resistance in your circuit design, especially if high precision is required.

6. Leakage Current:

   • The maximum leakage current through a switch when it is off is 100 nA. This can be significant in low-current applications.

7. Temperature Considerations:

   • Store the device within the temperature range of -65掳C to 150掳C.
   • Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.

8. Switching Time:

   • The switching time (tON, tOFF) is typically 1 渭s. This is important for applications requiring fast switching.

9. Handling:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage. Use proper ESD protection measures.

10. Layout:

    • Ensure a clean and stable power supply by using appropriate decoupling capacitors close to the VDD and GND pins.
    • Keep signal traces short to minimize noise and interference.

(For reference only)