UM1135

UM1135


Specifications
SKU
12612021
Details

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Parameter Description Min Typ Max Unit
Input Voltage (VIN) Operating input voltage range 2.7 - 5.5 V
Output Voltage (VOUT) Fixed output voltage - 3.3 - V
Output Current (IOUT) Maximum continuous output current - 500 - mA
Quiescent Current (IQ) Quiescent current at no load 1.0 - 2.0 渭A
Dropout Voltage (VDROP) Dropout voltage at IOUT = 500mA - 200 - mV
Thermal Shutdown Temperature (TSD) Thermal shutdown temperature - 160 - 掳C
Operating Junction Temperature (TJ) Operating junction temperature range -40 - 125 掳C
Storage Temperature (TSTORAGE) Storage temperature range -65 - 150 掳C

Instructions for Using UM1135

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.7V to 5.5V to avoid damage to the device.
  2. Output Voltage (VOUT):

    • The UM1135 provides a fixed output voltage of 3.3V. No external components are required to set this voltage.
  3. Output Current (IOUT):

    • The maximum continuous output current is 500mA. Ensure that the load does not exceed this limit to prevent overheating or damage.
  4. Quiescent Current (IQ):

    • The quiescent current is very low, ranging from 1.0渭A to 2.0渭A, making the UM1135 suitable for low-power applications.
  5. Dropout Voltage (VDROP):

    • The dropout voltage is typically 200mV at a maximum output current of 500mA. This ensures efficient operation even when the input voltage is close to the output voltage.
  6. Thermal Shutdown (TSD):

    • The device will automatically shut down if the junction temperature exceeds 160掳C to prevent thermal damage. Allow the device to cool before resuming operation.
  7. Operating Junction Temperature (TJ):

    • The operating junction temperature range is from -40掳C to 125掳C. Ensure that the device operates within this range to maintain reliability.
  8. Storage Temperature (TSTORAGE):

    • Store the device in an environment with a temperature range of -65掳C to 150掳C to ensure long-term stability.
  9. Mounting and Handling:

    • Handle the device with care to avoid mechanical stress or damage to the pins.
    • Follow standard soldering procedures to ensure proper mounting on the PCB.
  10. Capacitors:

    • Use appropriate input and output capacitors to stabilize the voltage and reduce ripple. Typical values are 1渭F for input and 1渭F for output, but these can vary based on specific application requirements.
  11. PCB Layout:

    • Place the UM1135 close to the load to minimize trace resistance and inductance.
    • Use wide and short traces for power and ground connections to reduce voltage drops and improve thermal performance.
  12. Testing:

    • After assembly, test the output voltage and current to ensure the device is functioning correctly.
    • Monitor the temperature during operation to ensure it stays within the specified limits.
(For reference only)

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