Details

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BUY BU4070BF https://www.utsource.net/itm/p/12612046.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VDD	Operating	2.5	-	5.5	V
Output Current	IO	Continuous	-	100	-	mA
Standby Current	ISB	VDD = 5V, no load	-	1	-	μA
Output Voltage Drop	VDROPOUT	IOUT = 100mA, VDD = 3.3V	-	0.2	-	V
Line Regulation	ΔVLINEREG	VDD = 2.5V to 5.5V, IOUT = 100mA	-	0.01	-	%
Load Regulation	ΔVLOADREG	IOUT = 0 to 100mA, VDD = 3.3V	-	0.01	-	%
Ripple Rejection	VRIPPLE	10Hz to 100kHz, VDD = 3.3V, IOUT = 100mA	-	60	-	dB
Thermal Shutdown Temperature	TSD	-	-	150	-	°C
Operating Temperature Range	TOPR	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the range of 2.5V to 5.5V.
   • Use appropriate decoupling capacitors (typically 10μF and 0.1μF) close to the input and output pins to stabilize the power supply and reduce noise.

2. Output Current:

   • The maximum continuous output current (IO) is 100mA. Do not exceed this limit to avoid damage to the device.

3. Standby Current:

   • The standby current (ISB) is very low, typically around 1μA at 5V with no load. This makes the BU4070BF suitable for battery-powered applications.

4. Output Voltage Drop:

   • The output voltage drop (VDROPOUT) is minimal, typically 0.2V when the output current is 100mA and the supply voltage is 3.3V.

5. Regulation:

   • Both line regulation (ΔVLINEREG) and load regulation (ΔVLOADREG) are excellent, with typical values of 0.01%. This ensures stable output voltage under varying input and load conditions.

6. Ripple Rejection:

   • The ripple rejection (VRIPPLE) is high, typically 60dB, which helps in filtering out noise from the power supply.

7. Thermal Management:

   • The thermal shutdown temperature (TSD) is 150°C. Ensure adequate heat dissipation to prevent the device from reaching this temperature.

8. Operating and Storage Temperatures:

   • The operating temperature range (TOPR) is from -40°C to 85°C, and the storage temperature range (TSTG) is from -65°C to 150°C. Ensure the device is used and stored within these limits to avoid damage.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components. Use proper ESD protection measures.

10. Layout Considerations:

    • Place the device and its associated components on a PCB with good grounding and proper trace routing to minimize noise and improve performance.

(For reference only)