Details
BUY 2SK847 https://www.utsource.net/itm/p/12612074.html
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Drain-Source Voltage (Max) | VDS(max) | 500 | V |
| Gate-Source Voltage (Max) | VGS(max) | 卤20 | V |
| Continuous Drain Current (Max) | ID(max) | 1.5 | A |
| Pulse Drain Current (Max) | IDP(max) | 3.0 | A |
| Total Power Dissipation (Max) | PD(max) | 40 | W |
| Junction Temperature (Max) | TJ(max) | 175 | 掳C |
| Storage Temperature Range | TSTG | -55 to 150 | 掳C |
Instructions for Use:
Mounting and Handling:
- Ensure proper heat sinking when operating at high power levels.
- Handle the device with care to avoid damage to leads or body.
Biasing Conditions:
- Operate within specified VDS, VGS, and ID limits to ensure reliable performance.
- Avoid exceeding the maximum gate-source voltage to prevent damage.
Thermal Considerations:
- Monitor junction temperature to stay below the maximum allowable limit.
- Proper ventilation or cooling solutions are recommended for extended operation.
Electrical Connections:
- Connect the source terminal to a common ground.
- Ensure that all connections are secure and insulated as necessary.
Storage and Operating Environment:
- Store in a dry, cool environment within the storage temperature range.
- Protect from static electricity during handling.
Testing:
- Perform initial testing under controlled conditions to validate performance parameters.
- Regularly check for any signs of overheating or abnormal behavior.
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