Details

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BUY BT169D. https://www.utsource.net/itm/p/12612079.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Forward Voltage	VF	-	1.2	1.8	V	@ IF = 100 mA, TA = 25掳C
Reverse Breakdown Voltage	VBR	400	-	600	V	@ IR = 5 渭A, TA = 25掳C
Forward Current	IF	-	-	100	mA	Continuous, TA = 25掳C
Peak Forward Current	IF(surge)	-	-	1000	mA	10 ms pulses, TA = 25掳C
Reverse Current	IR	-	-	5	渭A	@ VRRM = 400 V, TA = 25掳C
Power Dissipation	PT	-	-	1000	mW	TA = 25掳C
Operating Temperature	TOP	-40	-	125	掳C	-
Storage Temperature	TSTG	-55	-	150	掳C	-

Instructions for Use:

1. Forward Voltage (V_F): The device should be operated within the specified forward voltage range to avoid excessive power dissipation and potential damage.
2. Reverse Breakdown Voltage (V_BR): Ensure that the reverse voltage applied to the device does not exceed the maximum reverse breakdown voltage to prevent breakdown and potential failure.
3. Forward Current (I_F): The continuous forward current should not exceed the maximum rating to avoid overheating and damage.
4. Peak Forward Current (I_F(surge)): The device can handle higher peak currents for short durations (10 ms pulses), but ensure these pulses do not exceed the maximum peak forward current.
5. Reverse Current (I_R): Keep the reverse current within the specified limits to avoid excessive leakage.
6. Power Dissipation (P_T): Ensure that the power dissipation does not exceed the maximum rating to prevent thermal runaway and damage.
7. Operating Temperature (T_OP): The device is designed to operate within the specified temperature range. Exceeding these limits can lead to reduced performance or failure.
8. Storage Temperature (T_STG): Store the device within the specified storage temperature range to maintain its integrity.

Handling Precautions:

• ESD Sensitivity: The device is sensitive to electrostatic discharge (ESD). Handle with appropriate ESD protection measures.
• Mounting: Ensure proper mounting techniques to avoid mechanical stress on the device.
• Soldering: Follow recommended soldering profiles to prevent thermal damage during assembly.

(For reference only)