Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 4.5 | 5.0 | 5.5 | V | Operating supply voltage |
| Output Current | IOUT | - | 1.2 | 1.5 | A | Maximum continuous output current |
| Efficiency | 畏 | 85 | 90 | 93 | % | Power conversion efficiency |
| Switching Frequency | fSW | 400 | 500 | 600 | kHz | Internal switching frequency |
| Quiescent Current | IQ | 70 | 85 | 100 | 渭A | Current consumption in standby |
| Shutdown Current | ISD | 0.1 | 0.5 | 1.0 | 渭A | Current in shutdown mode |
| Operating Temperature | TOPR | -40 | 25 | 125 | 掳C | Operating ambient temperature range |
Instructions for SBA5089Z:
Power Supply Connection:
- Connect the positive terminal of the power supply to the VDD pin.
- Connect the negative terminal (GND) to the GND pin.
Output Configuration:
- Connect an external inductor and capacitor to the output for filtering.
- Ensure the load is connected between the VOUT pin and GND.
Thermal Considerations:
- Place the device on a suitable heatsink or PCB with adequate copper area for heat dissipation.
- Avoid operating at temperatures exceeding the maximum specified operating temperature.
Enable/Disable Control:
- Use the EN pin to control the operation of the device. High logic level enables the device, low disables it.
Protection Features:
- The device includes overcurrent protection, thermal shutdown, and undervoltage lockout.
- Ensure these features are not activated under normal operating conditions by adhering to the specified limits.
Layout Recommendations:
- Keep the input and output capacitors as close as possible to the device.
- Minimize trace lengths for high-frequency paths to reduce noise and improve performance.
Handling Precautions:
- Handle the device with care to avoid electrostatic discharge (ESD).
- Follow standard ESD handling procedures during assembly and testing.
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