LM26420XSQX/NOPB

LM26420XSQX/NOPB


Specifications
SKU
12612097
Details

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Parameter Symbol Min Typical Max Unit Conditions
Input Voltage VIN 4.5 - 17 V
Output Voltage VOUT - 3.3 - V Adjustable with external resistors
Output Current IOUT - 2 2.5 A Continuous
Switching Frequency fSW - 1.5 - MHz
Efficiency - 92 - % At 3.3V output, 2A load
Quiescent Current IQ - 60 - 渭A No load
Shutdown Current ISD - 1 - 渭A
Thermal Shutdown TSD - 160 - 掳C
Operating Temperature TOPR -40 - 125 掳C
Storage Temperature TSTG -65 - 150 掳C
Package Type - - X2QX - -

Instructions for Using LM26420XSQX/NOPB

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 17V.
    • Use appropriate input capacitors to stabilize the input voltage.
  2. Output Voltage (VOUT):

    • The output voltage can be adjusted using external feedback resistors.
    • Connect the feedback pin (FB) to the output through a resistor divider to set the desired output voltage.
  3. Output Current (IOUT):

    • The device can provide up to 2.5A continuous output current.
    • For higher current applications, ensure proper heat dissipation and use additional cooling if necessary.
  4. Switching Frequency (fSW):

    • The switching frequency is fixed at 1.5MHz.
    • This helps in reducing the size of external components like inductors and capacitors.
  5. Efficiency (畏):

    • The typical efficiency is 92% at 3.3V output and 2A load.
    • Efficiency can be optimized by selecting appropriate inductors and output capacitors.
  6. Quiescent Current (IQ):

    • The quiescent current is typically 60渭A when no load is present.
    • This low quiescent current helps in extending battery life in portable applications.
  7. Shutdown Current (ISD):

    • The shutdown current is typically 1渭A.
    • Use the shutdown pin (SHDN) to turn off the device and reduce power consumption.
  8. Thermal Shutdown (TSD):

    • The device will automatically shut down if the junction temperature exceeds 160掳C.
    • Ensure adequate thermal management to prevent overheating.
  9. Operating Temperature (TOPR):

    • The operating temperature range is from -40掳C to 125掳C.
    • Ensure the device is used within this temperature range to avoid damage.
  10. Storage Temperature (TSTG):

    • The storage temperature range is from -65掳C to 150掳C.
    • Store the device in a dry and cool environment to prevent damage.
  11. Package Type:

    • The device is available in an X2QX package.
    • Follow the recommended PCB layout guidelines for optimal performance and reliability.

Additional Notes:

  • Always refer to the datasheet for detailed information and specific application notes.
  • Use proper PCB layout techniques to minimize noise and ensure stable operation.
  • For high-reliability applications, consider derating the maximum ratings to ensure long-term reliability.
(For reference only)

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