Details

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BUY BM1Q001FJ-E2 https://www.utsource.net/itm/p/12612101.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Input Voltage	VIN	3.0	-	5.5	V
Output Voltage	VOUT	1.8	-	3.3	V	Adjustable
Output Current	IOUT	-	1.5	2.0	A
Quiescent Current	IQ	-	60	-	渭A
Dropout Voltage	VDROP	-	250	400	mV	At IOUT = 1.5A
Power Dissipation	PD	-	-	7.0	W
Operating Temperature	TOP	-40	-	125	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Junction Temperature	TJ	-40	-	150	掳C
Thermal Resistance	胃JA	-	25	-	掳C/W

Instructions for Use:

1. Input Voltage (V_IN):

   • Ensure the input voltage is within the specified range of 3.0V to 5.5V.
   • Do not exceed the maximum input voltage to avoid damage to the device.

2. Output Voltage (V_OUT):

   • The output voltage can be adjusted between 1.8V and 3.3V. Use the external resistor network to set the desired output voltage.
   • Refer to the datasheet for the specific resistor values required for different output voltages.

3. Output Current (I_OUT):

   • The device can provide a typical output current of 1.5A with a maximum of 2.0A.
   • Ensure the load does not exceed the maximum output current to prevent overheating or damage.

4. Quiescent Current (I_Q):

   • The quiescent current is typically 60渭A. This is the current consumed by the device when it is active but not supplying any load.

5. Dropout Voltage (V_DROP):

   • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 250mV at 1.5A and can go up to 400mV.

6. Power Dissipation (P_D):

   • The maximum power dissipation is 7.0W. Ensure adequate heat sinking or cooling if the device is operating near this limit.

7. Operating Temperature (T_OP):

   • The device can operate in temperatures ranging from -40掳C to 125掳C. Ensure the ambient temperature does not exceed these limits.

8. Storage Temperature (T_STG):

   • The device can be stored in temperatures ranging from -55掳C to 150掳C.

9. Junction Temperature (T_J):

   • The junction temperature should not exceed 150掳C to ensure reliable operation.

10. Thermal Resistance (胃_JA):

    • The thermal resistance from the junction to the ambient is typically 25掳C/W. Use this value to calculate the necessary heat sink size for your application.

Additional Notes:

• Always refer to the datasheet for detailed information and specific application notes.
• Proper PCB layout and component placement are crucial for optimal performance and reliability.
• Use appropriate bypass capacitors on both the input and output to ensure stability and reduce noise.

(For reference only)