MCP6022T-E/ST

MCP6022T-E/ST

Category: IC Chips

Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD Operating 1.8 - 5.5 V
Input Voltage Range VIN 0 - VDD V
Output Voltage Swing VOUT(SW) No load 0 - VDD-1.2 V
Quiescent Current IQ Per amplifier - 300 - μA
Input Offset Voltage VOS Over temperature -1 0.6 1 mV
Input Bias Current IB VIN = VDD/2 - 4 - pA
Slew Rate SR - 0.6 - V/μs
Gain Bandwidth Product GBP - 1.2 - MHz

Instructions for MCP6022T-E/ST

  1. Power Supply Connection:

    • Connect the power supply voltage (VDD) between 1.8V and 5.5V to the VDD pin.
    • Ensure a stable ground connection to the GND pin.
  2. Input Signal Application:

    • Apply input signals within the range of 0V to VDD to the non-inverting (+) and inverting (-) input pins.
    • Avoid exceeding the input voltage range to prevent damage.
  3. Output Configuration:

    • The output can swing from 0V to VDD - 1.2V under no-load conditions.
    • For optimal performance, ensure that the load does not exceed the output swing capability.
  4. Quiescent Current Consideration:

    • Each operational amplifier consumes approximately 300 μA of quiescent current.
    • This should be considered in battery-operated or low-power applications.
  5. Offset Voltage Compensation:

    • The input offset voltage is typically 0.6 mV over the operating temperature range.
    • Use external compensation techniques if precise offset control is required.
  6. Bias Current Management:

    • The input bias current is very low, around 4 pA at VIN = VDD/2.
    • Choose appropriate input resistances to minimize errors due to bias currents.
  7. Slew Rate Awareness:

    • The typical slew rate is 0.6 V/μs.
    • Design your circuit to handle this rate to avoid distortion in high-frequency applications.
  8. Gain Bandwidth Product Utilization:

    • The gain bandwidth product is 1.2 MHz.
    • Select feedback components to achieve desired closed-loop gains without compromising stability.
  9. Thermal Considerations:

    • Ensure adequate heat dissipation for reliable operation, especially at higher supply voltages or currents.
  10. Handling Precautions:

    • Handle the device with care to avoid electrostatic discharge (ESD).
    • Follow proper handling procedures as outlined by the manufacturer.
(For reference only)

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