TPS61160ADRVT

TPS61160ADRVT

Category: IC Chips

Specifications
Details

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Parameter Symbol Min Typ Max Unit Description
Input Voltage VIN 2.5 - 5.5 V Operating input voltage range
Output Voltage VOUT 3.0 - 18 V Adjustable output voltage
Switching Frequency fSW 1.0 - 2.0 MHz Switching frequency
Efficiency η - 90 - % Typical efficiency at rated conditions
Quiescent Current IQ - 45 - μA Quiescent current at no load
Load Current ILOAD - 100 1500 mA Continuous output current
Shutdown Current ISD - 0.6 - μA Current in shutdown mode
Start-Up Time tSTART - 1.5 - ms Time to reach regulation from UVLO
UVLO Threshold VUVLO 2.3 - - V Undervoltage lockout threshold
Thermal Shutdown TSD - 160 - °C Temperature at which device enters thermal SD

Instructions for Using TPS61160ADRVT

  1. Input Voltage Setup:

    • Ensure the input voltage is within the specified range (2.5V to 5.5V). Connect the input voltage to the VIN pin and ground.
  2. Output Voltage Configuration:

    • Use external resistors to set the desired output voltage according to the formula provided in the datasheet. Connect these resistors between the FB, GND, and VOUT pins.
  3. Switching Frequency Adjustment:

    • The switching frequency can be adjusted by connecting an external resistor to the RT pin. Refer to the datasheet for specific resistor values corresponding to desired frequencies.
  4. Enable/Disable Functionality:

    • To enable or disable the device, use the EN pin. A high signal on this pin enables the device, while a low signal disables it.
  5. Thermal Considerations:

    • Monitor the operating temperature to ensure it does not exceed the maximum thermal shutdown point of 160°C. Adequate heat sinking may be required depending on the application.
  6. Protection Features:

    • The device includes protection features such as undervoltage lockout (UVLO) and thermal shutdown. Ensure these are properly configured for your application.
  7. Layout Recommendations:

    • Follow good PCB layout practices to minimize noise and improve performance. Keep power traces short and wide, and place decoupling capacitors close to the IC.
  8. Application-Specific Adjustments:

    • For specific applications, refer to the detailed application notes provided in the full datasheet for additional guidance on component selection and circuit design.
(For reference only)

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