BTS409L1

BTS409L1


Specifications
SKU
12612110
Details

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Parameter Symbol Min Typ Max Unit Description
Continuous Drain Current ID - 40 - A Continuous drain current at Ta = 25°C
Peak Pulse Drain Current (t < 10 ms) Ipp - 80 - A Peak pulse drain current at Ta = 25°C
Drain-Source Voltage VDS - 40 - V Maximum drain-source voltage
Gate-Source Voltage VGS -20 - 20 V Maximum gate-source voltage
Gate Charge Qg - 65 - nC Total gate charge at VGS = 10V, VDS = 12V, ID = 20A
Input Capacitance Ciss - 1300 - pF Input capacitance at VDS = 12V, VGS = 0V
Output Capacitance Coss - 350 - pF Output capacitance at VDS = 12V, VGS = 0V
Reverse Transfer Capacitance Crss - 250 - pF Reverse transfer capacitance at VDS = 12V, VGS = 0V
On-State Resistance RDS(on) - 4.4 - On-state resistance at VGS = 10V, ID = 20A, Ta = 25°C
Gate-Threshold Voltage VGS(th) 1.8 2.5 3.2 V Gate-threshold voltage at ID = 250mA, Ta = 25°C
Junction Temperature Tj - - 175 °C Maximum junction temperature
Storage Temperature Tstg -40 - 150 °C Operating storage temperature range

Instructions for BTS409L1:

  1. Power Supply and Grounding:

    • Ensure that the power supply and ground connections are secure and have low impedance to minimize voltage drops and noise.
  2. Heat Dissipation:

    • The BTS409L1 can dissipate significant heat during operation. Use appropriate heatsinking or cooling methods to keep the junction temperature within safe limits.
  3. Gate Drive:

    • The gate of the BTS409L1 should be driven with a voltage between 0V and 20V. A typical drive voltage is 10V to ensure full enhancement.
    • Use a low-impedance driver to minimize switching losses and ensure fast turn-on and turn-off times.
  4. Overcurrent Protection:

    • Implement overcurrent protection to prevent damage from excessive current. The device has a maximum continuous drain current of 40A and a peak pulse current of 80A.
  5. Reverse Polarity Protection:

    • The device can handle reverse polarity up to -20V on the gate-source voltage. However, ensure that the drain-source voltage remains within the specified limits.
  6. Capacitance Considerations:

    • Be aware of the input, output, and reverse transfer capacitances when designing the circuit. These capacitances can affect the switching performance and may require compensation.
  7. Thermal Management:

    • Monitor the junction temperature and use thermal management techniques such as heatsinks, thermal paste, and forced air cooling to maintain the device within its operating temperature range.
  8. Storage and Handling:

    • Store the device in a dry, cool environment to prevent moisture damage. Handle the device with care to avoid mechanical stress and electrostatic discharge (ESD).
  9. Testing and Validation:

    • Before deploying the device in a final application, perform thorough testing and validation to ensure it meets all performance and safety requirements.
(For reference only)

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