Details

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BUY SI7390 https://www.utsource.net/itm/p/12612141.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	2.5	-	5.5	V	Operating supply voltage range
Quiescent Current	IQ	-	1.5	-	渭A	Quiescent current at VDD = 3.3V, TA = 25掳C
Output Voltage (High)	VOH	-	3.3	-	V	Output high voltage at VDD = 3.3V, IL = -100渭A, TA = 25掳C
Output Voltage (Low)	VOL	-	0.4	-	V	Output low voltage at VDD = 3.3V, IH = 100渭A, TA = 25掳C
Input Voltage Range	VIN	0	-	VDD	V	Input voltage range for digital inputs
Operating Temperature	TOP	-40	-	85	掳C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range
ESD Rating	HBM	-	2000	-	V	Human Body Model ESD rating

Instructions for Use

1. Supply Voltage:

   • Ensure the supply voltage (V_DD) is within the range of 2.5V to 5.5V.
   • Connect the V_DD pin to the positive supply and the GND pin to the ground.

2. Quiescent Current:

   • The device typically draws 1.5渭A of quiescent current at 3.3V and 25掳C.
   • This low current consumption makes it suitable for battery-powered applications.

3. Output Levels:

   • The output high voltage (V_OH) is typically 3.3V when the supply voltage is 3.3V and the load current is -100渭A.
   • The output low voltage (V_OL) is typically 0.4V when the supply voltage is 3.3V and the load current is 100渭A.

4. Input Voltage Range:

   • Digital inputs should be within the range of 0V to V_DD.

5. Operating and Storage Temperature:

   • The device can operate within a temperature range of -40掳C to 85掳C.
   • It can be stored between -65掳C and 150掳C.

6. ESD Protection:

   • The device has an ESD rating of 2000V according to the Human Body Model (HBM).
   • Handle the device with care to avoid ESD damage.

7. Handling and Mounting:

   • Use proper handling techniques to prevent static discharge.
   • Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.

8. Application Notes:

   • Refer to the datasheet for detailed application notes and specific circuit configurations.
   • Ensure all necessary decoupling capacitors are placed close to the power pins to maintain stability and performance.

(For reference only)