Details

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BUY PD64012G https://www.utsource.net/itm/p/12612143.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	2.7	-	5.5	V	Operating supply voltage range
Input Voltage Range	VIN	0	-	5.5	V	Input voltage range for analog signals
Output Voltage Range	VOUT	0	-	3.3	V	Output voltage range
Maximum Output Current	IOUT	-	100	-	mA	Maximum continuous output current
Power Consumption	ICC	-	10	-	渭A	Typical power consumption in active mode
Shutdown Current	ISD	-	0.1	-	渭A	Typical power consumption in shutdown mode
Operating Temperature	TOPR	-40	-	85	掳C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range
Input Capacitance	CIN	-	10	-	pF	Input capacitance
Output Capacitance	COUT	-	10	-	pF	Output capacitance
Response Time	TR	-	10	-	渭s	Typical response time

Instructions

1. Power Supply Connection:

   • Connect the VDD pin to a power supply within the range of 2.7V to 5.5V.
   • Ensure the GND pin is connected to the ground.

2. Input Signal:

   • Apply the input signal to the VIN pin. The input voltage should be within the range of 0V to 5.5V.

3. Output Signal:

   • The output signal will be available at the VOUT pin. The output voltage range is 0V to 3.3V.

4. Current Limitation:

   • Do not exceed the maximum output current of 100mA to avoid damaging the device.

5. Power Consumption:

   • In active mode, the device typically consumes 10渭A.
   • To enter shutdown mode, set the SHDN pin to a low state (0V). In this mode, the power consumption is typically 0.1渭A.

6. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 85掳C.
   • Store the device within the temperature range of -65掳C to 150掳C.

7. Capacitance:

   • Use external capacitors with values close to the typical input and output capacitance (10pF) to ensure stable operation.

8. Response Time:

   • The typical response time of the device is 10渭s. Ensure that your application can accommodate this delay.

9. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow proper soldering techniques to avoid thermal stress during assembly.

10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your specific application.

(For reference only)