Details
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| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage (Vcc) | Operating supply voltage | 4.5 | 5.0 | 5.5 | V |
| Output Current (Iout) | Maximum continuous output current | - | 100 | - | mA |
| Quiescent Current (Iq) | Supply current at no load | 0.1 | 0.5 | 1.0 | mA |
| Output Voltage (Vout) | Output voltage range | 0.5 | - | 4.5 | V |
| Power Dissipation (Pd) | Maximum power dissipation | - | 250 | - | mW |
| Operating Temperature (Toper) | Operating temperature range | -40 | 25 | 85 | 掳C |
| Storage Temperature (Tstg) | Storage temperature range | -65 | - | 150 | 掳C |
| Thermal Resistance (胃ja) | Junction-to-ambient thermal resistance | - | 150 | - | 掳C/W |
Instructions for Using UPA68HA
Supply Voltage:
- Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
Output Current:
- The maximum continuous output current is 100mA. Do not exceed this limit to prevent overheating and potential failure.
Quiescent Current:
- The quiescent current is typically 0.5mA but can vary between 0.1mA and 1.0mA. This should be considered when designing low-power applications.
Output Voltage:
- The output voltage can range from 0.5V to 4.5V. Ensure that the load connected to the output is compatible with this voltage range.
Power Dissipation:
- The maximum power dissipation is 250mW. Proper heat sinking or cooling may be required if the device is operating near this limit.
Operating Temperature:
- The device is designed to operate within a temperature range of -40掳C to 85掳C. Avoid operating outside this range to ensure reliable performance.
Storage Temperature:
- When storing the device, keep it within a temperature range of -65掳C to 150掳C to prevent damage.
Thermal Resistance:
- The junction-to-ambient thermal resistance is 150掳C/W. Use this value to calculate the necessary heat dissipation for your application.
Mounting:
- Ensure proper mounting techniques to avoid mechanical stress on the device. Follow the recommended soldering profile and handling guidelines.
Testing:
- Before finalizing the design, perform thorough testing under various conditions to ensure the device meets all performance requirements.
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