Details

---

BUY 74F604N https://www.utsource.net/itm/p/12612171.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	Vcc	Operating	4.5	-	5.5	V
Input Low Voltage	VI(L)	IIL = 1 mA	0	-	0.8	V
Input High Voltage	VI(H)	IIH = -20 渭A	2.0	-	Vcc	V
Output Low Voltage	VO(L)	IO = 4 mA	0	-	0.4	V
Output High Voltage	VO(H)	IO = -4 mA	2.4	-	Vcc	V
Propagation Delay Time	tpd	Vcc = 5V, Tamb = 25掳C	-	3.5	7	ns
Power Dissipation	PD	Per Package	-	-	100	mW
Operating Temperature	Tamb		-40	-	85	掳C
Storage Temperature	Tstg		-65	-	150	掳C

Instructions for Use:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the specified range of 4.5V to 5.5V to avoid damage to the device.

2. Input Voltage Levels:

   • Input voltages should be within the specified ranges to ensure proper logic levels:
     • Low input voltage (VI(L)): 0V to 0.8V.
     • High input voltage (VI(H)): 2.0V to Vcc.

3. Output Voltage Levels:

   • Output voltages will be:
     • Low output voltage (VO(L)): 0V to 0.4V when sourcing 4 mA.
     • High output voltage (VO(H)): 2.4V to Vcc when sinking 4 mA.

4. Propagation Delay Time (tpd):

   • The typical propagation delay time is 3.5 ns with a maximum of 7 ns at Vcc = 5V and ambient temperature (Tamb) = 25掳C.

5. Power Dissipation:

   • The maximum power dissipation per package is 100 mW. Ensure adequate heat dissipation if operating near this limit.

6. Operating Temperature (Tamb):

   • The device is designed to operate within the temperature range of -40掳C to 85掳C. Avoid operating outside this range to prevent damage or reduced performance.

7. Storage Temperature (Tstg):

   • Store the device in an environment where the temperature does not exceed -65掳C to 150掳C to maintain its integrity.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Use appropriate anti-static measures when handling and storing the device.

9. Mounting and Soldering:

   • Follow standard soldering procedures to avoid thermal shock and mechanical stress during assembly.
   • Ensure that the device is properly mounted and connected to the circuit board to prevent issues such as poor electrical contact.

10. Testing:

    • Before integrating the device into a larger system, perform initial tests to verify its functionality and performance according to the specified parameters.

(For reference only)