Details

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BUY FA3641N-H1 https://www.utsource.net/itm/p/12612177.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VDD	Operating	2.7	-	5.5	V
Input Voltage Range	VIN	Operating	0	-	5.5	V
Output Current	IOUT	Continuous	-	200	-	mA
Quiescent Current	IQ	VDD = 5V, No Load	-	1.5	-	渭A
Shutdown Current	ISD	VSD = 0V	-	0.1	-	渭A
Output Voltage	VOUT	No Load, VDD = 5V	-	3.3	-	V
Dropout Voltage	VDROPOUT	IOUT = 100mA	-	0.3	-	V
Operating Temperature	TOPR	Junction	-40	-	125	掳C
Storage Temperature	TSTG		-65	-	150	掳C

Instructions for FA3641N-H1

1. Supply Voltage (VDD):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.

2. Input Voltage Range (VIN):

   • The input voltage should be within the same range as the supply voltage (0V to 5.5V) to ensure proper operation.

3. Output Current (IOUT):

   • The device can provide a continuous output current of up to 200mA. Exceeding this limit may cause overheating or damage.

4. Quiescent Current (IQ):

   • The quiescent current is typically 1.5渭A when the supply voltage is 5V and there is no load. This low current consumption helps in power-efficient designs.

5. Shutdown Current (ISD):

   • When the shutdown pin (VSD) is set to 0V, the shutdown current is typically 0.1渭A. Use this feature to reduce power consumption when the device is not in use.

6. Output Voltage (VOUT):

   • Under no load conditions and with a supply voltage of 5V, the output voltage is typically 3.3V. Ensure the load does not significantly affect this voltage.

7. Dropout Voltage (VDROPOUT):

   • The dropout voltage is typically 0.3V at an output current of 100mA. This indicates the minimum difference between the input and output voltages required for stable regulation.

8. Operating Temperature (TOPR):

   • The device can operate within a junction temperature range of -40掳C to 125掳C. Ensure adequate thermal management to keep the device within this range.

9. Storage Temperature (TSTG):

   • Store the device in an environment with a temperature range of -65掳C to 150掳C to prevent damage.

10. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow proper soldering techniques to avoid thermal shock and ensure good electrical connections.

11. Application Notes:

    • For optimal performance, use appropriate decoupling capacitors near the input and output pins.
    • Ensure the PCB layout minimizes noise and interference for reliable operation.

(For reference only)