Details
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| Parameter | Symbol | Test Conditions | Min | Typical | Max | Unit |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 3.0 | - | 42 | V | |
| Output Voltage (Adjustable) | VOUT | 0.8 | - | 40 | V | |
| Output Current | IOUT | Continuous | - | 3.5 | 4.0 | A |
| Switching Frequency | fSW | 500 | - | 2000 | kHz | |
| Efficiency | 畏 | - | - | 96 | - | % |
| Quiescent Current | IQ | VIN = 12V, No Load | - | 25 | - | 渭A |
| Shutdown Current | ISD | VIN = 12V, VEN = 0V | - | 1 | - | 渭A |
| Soft-Start Time | tSS | - | - | 4.5 | - | ms |
| Thermal Shutdown Temperature | TSD | - | 160 | - | - | 掳C |
| Operating Junction Temperature | TJ | - | -65 | - | 150 | 掳C |
| Storage Temperature | TSTG | - | -65 | - | 150 | 掳C |
Instructions:
Input Voltage (VIN):
- Ensure the input voltage is within the range of 3.0V to 42V.
- Use appropriate input capacitors to stabilize the input voltage.
Output Voltage (VOUT):
- The output voltage can be adjusted from 0.8V to 40V using external resistors.
- Use the formula ( V_ = 0.8 left(1 + fracright) ) to set the desired output voltage.
Output Current (IOUT):
- The device can provide a continuous output current of up to 3.5A, with a peak of 4.0A.
- Ensure adequate heat sinking for high current applications.
Switching Frequency (fSW):
- The switching frequency can be set between 500kHz and 2000kHz using an external resistor.
- Use the formula ( f_ = frac{1.1 times 10^6} ) where ( R_f ) is in ohms.
Efficiency (畏):
- The device can achieve up to 96% efficiency under optimal conditions.
- Efficiency is influenced by input voltage, output voltage, and load current.
Quiescent Current (IQ):
- The quiescent current is typically 25渭A at 12V input with no load.
- Ensure low quiescent current to minimize power loss in low-power applications.
Shutdown Current (ISD):
- The shutdown current is typically 1渭A when the enable pin (VEN) is set to 0V.
- Use the enable pin to control the operation of the device.
Soft-Start Time (tSS):
- The soft-start time is typically 4.5ms.
- This helps to reduce inrush current during startup.
Thermal Shutdown (TSD):
- The device will shut down if the junction temperature exceeds 160掳C.
- Ensure proper thermal management to prevent overheating.
Operating Junction Temperature (TJ):
- The operating junction temperature range is from -65掳C to 150掳C.
- Ensure the device operates within this temperature range to avoid damage.
Storage Temperature (TSTG):
- The storage temperature range is from -65掳C to 150掳C.
- Store the device in a suitable environment to prevent damage.
Additional Notes:
- Always refer to the datasheet for detailed specifications and application notes.
- Use recommended external components for optimal performance.
- Follow good PCB layout practices to ensure reliable operation.
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