Details

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BUY HD63B03YP. https://www.utsource.net/itm/p/12612202.html

Parameter	Symbol	Min	Typical	Max	Unit	Description
Supply Voltage	Vcc	4.5	5.0	5.5	V	Operating voltage range
Supply Current	ICC	-	10	-	mA	Quiescent current
Output Voltage (High)	VOH	-	4.5	5.0	V	Output voltage when high
Output Voltage (Low)	VOL	0.0	0.4	0.5	V	Output voltage when low
Input Voltage (High)	VIH	2.0	3.5	5.0	V	Minimum input voltage for logic high
Input Voltage (Low)	VIL	0.0	1.5	2.0	V	Maximum input voltage for logic low
Input Leakage Current	IIL	-1	0	1	渭A	Maximum leakage current at input pins
Output Sink Current	IOS	10	20	30	mA	Maximum current that can be sunk by output pin
Output Source Current	IOH	10	20	30	mA	Maximum current that can be sourced by output pin
Operating Temperature	Toper	-40	-	85	掳C	Operating temperature range
Storage Temperature	Tstg	-65	-	150	掳C	Storage temperature range
Propagation Delay Time	tpd	-	100	200	ns	Time delay from input to output
Power Dissipation	PD	-	500	-	mW	Maximum power dissipation

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • Connect the Vcc pin to the positive supply and the GND pin to the ground.

2. Input Signals:

   • Apply input signals (VIH and VIL) within the specified voltage ranges to avoid undefined behavior.
   • Ensure input signals are clean and stable to prevent false triggering.

3. Output Handling:

   • Do not exceed the maximum output sink and source currents (IOS and IOH).
   • Use appropriate pull-up or pull-down resistors if needed to ensure proper logic levels.

4. Temperature Considerations:

   • Operate the device within the specified operating temperature range (-40掳C to 85掳C).
   • Store the device within the storage temperature range (-65掳C to 150掳C).

5. Propagation Delay:

   • Account for the propagation delay time (tpd) in your timing calculations to ensure proper operation.

6. Power Dissipation:

   • Ensure the power dissipation (PD) does not exceed the maximum rating to avoid overheating and potential damage.

7. Handling Precautions:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow recommended PCB layout guidelines to ensure optimal performance and reliability.

(For reference only)