Details

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Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Input Voltage Range	VIN	7	-	100	V	-
Output Voltage Range	VOUT	0.8	-	60	V	-
Switching Frequency	fSW	-	300	1000	kHz	-
Quiescent Current	IQ	-	3.5	-	mA	VIN = 12V, No Load
Load Regulation	-	-	0.5	-	%	10% to 100% Load
Line Regulation	-	-	0.2	-	%/V	VIN = 12V to 36V
Efficiency	η	-	90	-	%	VIN = 12V, VOUT = 5V, IOUT = 1A
Start-Up Time	tSTART	-	1.5	-	ms	VIN = 12V, VOUT = 5V
Short-Circuit Protection	SCP	-	-	-	-	Cycles, Auto Recovery
Overvoltage Protection	OVP	-	-	-	-	VOUT > 110% of Set Point
Thermal Shutdown	TSD	-	-	-	°C	TJ > 160°C

Instructions for Use

1. Input Connection:

   • Connect the input voltage (VIN) to the designated input pin.
   • Ensure the input voltage is within the specified range (7V to 100V).

2. Output Configuration:

   • Set the desired output voltage (VOUT) using the feedback resistor network.
   • The output voltage can be adjusted from 0.8V to 60V.

3. Switching Frequency:

   • The switching frequency (fSW) can be set between 300kHz and 1000kHz using an external resistor or capacitor.

4. Quiescent Current:

   • The quiescent current is typically 3.5mA at 12V input with no load.

5. Load and Line Regulation:

   • The load regulation is typically 0.5% over the load range from 10% to 100%.
   • The line regulation is typically 0.2% per volt over the input voltage range from 12V to 36V.

6. Efficiency:

   • The efficiency is typically 90% when operating at 12V input, 5V output, and 1A load.

7. Start-Up Time:

   • The start-up time is typically 1.5ms when the input voltage is 12V and the output voltage is 5V.

8. Protection Features:

   • Short-Circuit Protection (SCP): The device will cycle and automatically recover from short circuits.
   • Overvoltage Protection (OVP): The device will shut down if the output voltage exceeds 110% of the set point.
   • Thermal Shutdown (TSD): The device will shut down if the junction temperature exceeds 160°C.

9. Thermal Management:

   • Ensure adequate heat sinking to keep the junction temperature below the thermal shutdown threshold.

10. Layout Considerations:

    • Place input and output capacitors close to the respective pins to minimize parasitic inductance.
    • Use wide traces for power paths to reduce resistance and improve thermal performance.

11. Component Selection:

    • Choose external components such as inductors, capacitors, and resistors based on the specific application requirements and the datasheet recommendations.

For detailed design and application notes, refer to the LM5026SD/NOPB datasheet and application notes provided by the manufacturer.

(For reference only)