Details

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BUY TIC216M https://www.utsource.net/itm/p/12612223.html

Parameter	Symbol	Min	Typ	Max	Unit
Input Voltage	VIN	4.5	-	30	V
Output Current	IOUT	-	1.5	2.5	A
Thermal Shutdown	TSD	-	-	160	掳C
Operating Temperature	TOP	-40	-	125	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Junction-to-Case Thermal Resistance	R胃JC	-	1.8	-	掳C/W

Instructions for TIC216M

1. Power Supply Connection:

   • Connect the input voltage (V_IN) to the power supply within the specified range of 4.5V to 30V.
   • Ensure the output current (I_OUT) does not exceed 2.5A to avoid damage.

2. Thermal Management:

   • Monitor the operating temperature (T_OP) to ensure it remains within -40掳C to 125掳C.
   • If the device reaches the thermal shutdown temperature (T_SD) of 160掳C, it will automatically shut down to prevent damage.

3. Storage Conditions:

   • Store the device in an environment where the temperature ranges from -55掳C to 150掳C.

4. Thermal Resistance:

   • The junction-to-case thermal resistance (R_胃JC) is 1.8掳C/W. Use appropriate heatsinks or cooling methods to manage heat dissipation effectively.

5. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.

6. Mounting:

   • Ensure proper mounting to a heatsink if high power dissipation is expected.
   • Use thermal paste between the device and the heatsink to improve thermal conductivity.

7. Testing:

   • Before final assembly, test the device under typical operating conditions to ensure it meets the required performance specifications.

8. Troubleshooting:

   • If the device fails to operate correctly, check the input voltage, output current, and thermal conditions.
   • Verify that all connections are secure and free from shorts or open circuits.

(For reference only)