Details

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BUY ADG212AKRZ https://www.utsource.net/itm/p/12612232.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VDD	Operating Range	2.7	-	5.5	V
Quiescent Current	IQ	VDD = 5V	-	0.3	-	mA
Channel-to-Channel Isolation	ISO	f = 1 MHz, VDD = 5V	-	-	80	dB
On-State Resistance	RON	VDD = 5V, TA = 25掳C	1.2	-	2.4	惟
Off-State Leakage Current	ILEAK	VDD = 5V, TA = 25掳C	-	-	1	nA
Switching Time	tSW	VDD = 5V, RL = 1 k惟	-	0.1	-	渭s
Input Signal Range	VIN		-0.3	-	VDD + 0.3	V
Operating Temperature	Toper		-40	-	85	掳C
Storage Temperature	Tstg		-65	-	150	掳C

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
   • The quiescent current (IQ) is typically 0.3mA at 5V.

2. Channel Isolation:

   • The channel-to-channel isolation (ISO) is 80dB at 1 MHz and 5V supply.

3. On-State Resistance:

   • The on-state resistance (RON) is between 1.2惟 and 2.4惟 at 5V and 25掳C ambient temperature.

4. Off-State Leakage Current:

   • The off-state leakage current (ILEAK) is less than 1nA at 5V and 25掳C ambient temperature.

5. Switching Time:

   • The switching time (tSW) is 0.1渭s with a 1k惟 load and 5V supply.

6. Input Signal Range:

   • The input signal range (VIN) should be between -0.3V and VDD + 0.3V.

7. Temperature:

   • The operating temperature (Toper) range is from -40掳C to 85掳C.
   • The storage temperature (Tstg) range is from -65掳C to 150掳C.

8. Handling and Storage:

   • Store the device in a dry, cool environment to prevent damage.
   • Handle the device with care to avoid static discharge, which can damage the internal components.

9. Mounting and Soldering:

   • Follow standard surface mount technology (SMT) guidelines for mounting and soldering.
   • Use a controlled soldering process to avoid excessive heat, which can damage the device.

10. Testing:

    • Test the device under specified conditions to ensure proper functionality.
    • Verify the supply voltage, input signals, and temperature conditions during testing.

(For reference only)