Details

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BUY LTC2955IDDB-1 https://www.utsource.net/itm/p/12612252.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Input Voltage Range	VIN	Continuous	2.9	-	5.5	V
Output Voltage	VOUT	-	3.3	-	-	V
Output Current	IOUT	Continuous	-	600	-	mA
Quiescent Current	IQ	VIN = 3.3V, No Load	-	1.5	-	μA
Dropout Voltage	VDROPOUT	IOUT = 300mA, VIN = 3.3V	-	0.3	-	V
Enable Input High Voltage	VEN(HI)	-	1.2	-	-	V
Enable Input Low Voltage	VEN(LO)	-	-	-	0.8	V
Shutdown Current	ISD	VIN = 3.3V, EN = 0V	-	0.1	-	μA
Thermal Shutdown Temperature	TSD	-	160	-	-	°C
Operating Junction Temperature	TJ	-	-40	-	125	°C

Instructions for Use:

1. Power Supply:

   • Ensure the input voltage (VIN) is within the specified range of 2.9V to 5.5V.
   • The output voltage (VOUT) is fixed at 3.3V.

2. Output Current:

   • The device can continuously supply up to 600mA of output current.

3. Quiescent Current:

   • The quiescent current (IQ) is typically 1.5μA when the input voltage is 3.3V and there is no load.

4. Dropout Voltage:

   • The dropout voltage (VDROPOUT) is typically 0.3V when the output current is 300mA and the input voltage is 3.3V.

5. Enable Pin:

   • The enable pin (EN) should be set to a high voltage (VEN(HI) > 1.2V) to turn on the regulator.
   • Set the enable pin to a low voltage (VEN(LO) < 0.8V) to turn off the regulator.

6. Shutdown Current:

   • When the enable pin is low (EN = 0V) and the input voltage is 3.3V, the shutdown current (ISD) is typically 0.1μA.

7. Thermal Management:

   • The device will shut down if the junction temperature (TSD) exceeds 160°C.
   • Ensure the operating junction temperature (TJ) remains between -40°C and 125°C.

8. Layout Considerations:

   • Place the input and output capacitors as close as possible to the respective pins to minimize noise and improve stability.
   • Use a good thermal design to ensure proper heat dissipation, especially under high current conditions.

9. Capacitors:

   • Use ceramic capacitors with X7R or better dielectric for both input and output.
   • Typical values are 1μF for input and 10μF for output.

10. PCB Design:

    • Ensure wide and short traces for power and ground to reduce inductance and resistance.
    • Use a ground plane to help with thermal management and reduce noise.

(For reference only)