Details

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BUY EN6347QA https://www.utsource.net/itm/p/12612300.html

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	Vcc	2.7	-	5.5	V
Output Current (Max)	Iout	-	100	-	mA
Quiescent Current	IQ	-	10	-	渭A
Dropout Voltage	Vdo	-	0.3	-	V
Load Regulation	-	-	0.5	-	%
Line Regulation	-	-	0.1	-	%
Thermal Shutdown	TSD	-	160	-	掳C
Operating Temperature	Topr	-40	-	85	掳C
Storage Temperature	Tstg	-55	-	150	掳C

Instructions for Use:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.

2. Output Current (Iout):

   • The maximum output current is 100mA. Do not exceed this limit to prevent overheating or damage.

3. Quiescent Current (IQ):

   • The quiescent current is typically 10渭A, which is the current consumed by the device when no load is present.

4. Dropout Voltage (Vdo):

   • The dropout voltage is typically 0.3V, meaning the input voltage must be at least 0.3V higher than the output voltage for the regulator to function properly.

5. Load Regulation:

   • The load regulation is typically 0.5%, indicating the change in output voltage due to changes in load current.

6. Line Regulation:

   • The line regulation is typically 0.1%, indicating the change in output voltage due to changes in input voltage.

7. Thermal Shutdown (TSD):

   • The device will automatically shut down if the temperature exceeds 160掳C to prevent thermal damage.

8. Operating Temperature (Topr):

   • The operating temperature range is from -40掳C to 85掳C. Ensure the device operates within this range for optimal performance.

9. Storage Temperature (Tstg):

   • The storage temperature range is from -55掳C to 150掳C. Store the device in this range to avoid damage.

10. Mounting:

    • Mount the device on a PCB with appropriate thermal management techniques, such as heat sinks or thermal vias, to ensure proper heat dissipation.

11. Capacitors:

    • Use recommended input and output capacitors to stabilize the voltage and reduce ripple. Typically, a 10渭F ceramic capacitor is used for both input and output.

12. PCB Layout:

    • Ensure the PCB layout minimizes trace lengths and uses wide traces for power and ground to reduce resistance and inductance.

(For reference only)