HD3SS6126RUAR
Specifications
SKU
12612303
Details
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Parameter | Description | Value | Unit |
---|---|---|---|
Supply Voltage (VDD) | Operating supply voltage range | 2.7 to 5.5 | V |
Supply Current (IDD) | Quiescent supply current (Typical) | 1.0 | μA |
Channel Configuration | Number of channels | 2 | - |
Channel Resistance (RON) | On-state resistance per channel (Typical) | 0.8 | Ω |
Channel Capacitance (Cin) | Input capacitance per channel (Typical) | 4.5 | pF |
Switching Time (tON, tOFF) | Turn-on/turn-off time (Typical) | 15 | ns |
Maximum Continuous Current (IOUT) | Continuous output current per channel | ±200 | mA |
Maximum Pulse Current (IOUT) | Peak pulse output current per channel | ±400 | mA |
Operating Temperature Range (TA) | Ambient operating temperature range | -40 to 85 | °C |
Storage Temperature Range (TSTG) | Storage temperature range | -65 to 150 | °C |
ESD Rating (HBM) | Human body model electrostatic discharge rating | 2000 | V |
ESD Rating (MM) | Machine model electrostatic discharge rating | 200 | V |
Package Type | Type of package | SOT-23-6 | - |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VDD) is within the specified range of 2.7V to 5.5V.
- Connect the supply voltage to the VDD pin and ground to the GND pin.
Channel Configuration:
- The HD3SS6126RUAR has two channels. Each channel can be independently controlled.
- Connect the input signals to the IN1 and IN2 pins, and the corresponding outputs will be available at OUT1 and OUT2.
Current Handling:
- Do not exceed the maximum continuous current of ±200mA or the peak pulse current of ±400mA per channel.
- Ensure that the load connected to the output does not draw more current than these limits.
Temperature Considerations:
- Operate the device within the ambient temperature range of -40°C to 85°C.
- Store the device within the storage temperature range of -65°C to 150°C.
ESD Protection:
- Handle the device with care to avoid electrostatic discharge (ESD).
- Use appropriate ESD protection measures during handling and installation.
Layout and PCB Design:
- Use short traces for high-frequency signals to minimize parasitic inductance and capacitance.
- Ensure proper grounding and decoupling capacitors are used to maintain stable operation.
Testing and Verification:
- Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications.
- Verify the switching times and on-state resistance to ensure optimal performance.
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