Details

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BUY LT3790IFE#PBF https://www.utsource.net/itm/p/12612305.html

Parameter	Symbol	Min	Typical	Max	Unit
Input Voltage Range	VIN	4.5	-	60	V
Output Voltage Range	VOUT	0.8	-	100	V
Switching Frequency	fSW	100	500	1000	kHz
Output Current (Continuous)	IOUT	-	10	-	A
Efficiency (Typical)	η	-	92	-	%
Quiescent Current	IQ	-	1.2	-	mA
Shutdown Current	ISD	-	1	-	μA
Operating Temperature Range	Toper	-40	-	125	°C
Storage Temperature Range	Tstg	-65	-	150	°C
Junction Temperature	TJ	-40	-	150	°C

Instructions for Use

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 4.5V to 60V.
   • Connect the input power supply to the VIN pin.

2. Output Voltage (VOUT):

   • Set the desired output voltage using the feedback resistor network.
   • The output voltage can be adjusted from 0.8V to 100V.

3. Switching Frequency (fSW):

   • Set the switching frequency by connecting an external resistor to the RT pin.
   • The typical switching frequency is 500kHz, but it can be adjusted between 100kHz and 1000kHz.

4. Output Current (IOUT):

   • The continuous output current is up to 10A.
   • Ensure the inductor and other components can handle the required current.

5. Efficiency:

   • The typical efficiency is 92%.
   • Optimize the design for maximum efficiency by selecting appropriate components and minimizing losses.

6. Quiescent Current (IQ):

   • The quiescent current is typically 1.2mA.
   • This is the current consumed by the IC when it is active but not delivering power to the load.

7. Shutdown Current (ISD):

   • The shutdown current is typically 1μA.
   • Use the SHDN pin to control the shutdown mode.

8. Operating Temperature (Toper):

   • The operating temperature range is from -40°C to 125°C.
   • Ensure the device is used within this range to avoid damage.

9. Storage Temperature (Tstg):

   • The storage temperature range is from -65°C to 150°C.
   • Store the device in a dry and cool environment.

10. Junction Temperature (TJ):

    • The junction temperature should not exceed 150°C.
    • Use proper heat sinking and cooling methods to manage the junction temperature.

11. PCB Layout:

    • Follow recommended PCB layout guidelines to minimize noise and ensure stable operation.
    • Keep high-current paths short and wide to reduce resistance and inductance.

12. Component Selection:

    • Choose components with ratings that exceed the maximum expected values to ensure reliability.
    • Use high-quality capacitors and inductors suitable for the application.

13. Protection:

    • Implement overvoltage, overcurrent, and thermal protection circuits as needed.
    • Monitor the output voltage and current to prevent damage to the load or the IC.

(For reference only)