Details

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BUY FDP075N15A-F102 https://www.utsource.net/itm/p/12612323.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	150	-	V	-
Gate-Source Voltage	VGS	-15	0	20	V	-
Continuous Drain Current	ID	-	75	-	A	TC = 25掳C
Continuous Drain Current	ID	-	45	-	A	TC = 100掳C
Pulse Drain Current	IDM	-	180	-	A	TC = 25掳C, tp = 10 渭s, IG = 10 A
Gate Charge	QG	-	36	-	nC	VGS = 15 V, ID = 50 A
Input Capacitance	Ciss	-	1500	-	pF	VDS = 100 V, f = 1 MHz
Output Capacitance	Coss	-	160	-	pF	VDS = 100 V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	320	-	pF	VDS = 100 V, f = 1 MHz
On-State Resistance	RDS(on)	-	0.0085	-	惟	VGS = 10 V, ID = 50 A
Threshold Voltage	VGS(th)	2.0	3.0	4.0	V	ID = 250 渭A
Total Power Dissipation	PTOT	-	220	-	W	TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C	-
Storage Temperature Range	TSTG	-55	-	150	掳C	-

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid damage to the pins.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure proper thermal management by using a heatsink if necessary.
   • Apply thermal paste between the device and the heatsink for better heat dissipation.

3. Biasing:

   • Apply the gate-source voltage (V_GS) within the specified range to ensure reliable operation.
   • Avoid exceeding the maximum gate-source voltage to prevent damage to the device.

4. Current Limiting:

   • Do not exceed the continuous drain current (I_D) ratings, especially at higher temperatures.
   • For pulse applications, ensure that the pulse duration and current do not exceed the specified limits.

5. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it does not exceed the maximum rating.
   • Use appropriate cooling methods to maintain the device within safe operating temperatures.

6. Capacitance Considerations:

   • Be aware of the input, output, and reverse transfer capacitances when designing circuits to avoid instability or excessive switching losses.

7. Storage:

   • Store the device in a dry, cool place within the specified storage temperature range to prevent degradation.

8. Testing:

   • Before finalizing the design, test the device under actual operating conditions to ensure it meets all performance requirements.

(For reference only)