Details

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BUY MT48LC8M16A2TG-8E https://www.utsource.net/itm/p/12612354.html

Parameter	Description	Value
Type	Synchronous DRAM (SDRAM)
Density	128 Mbit
Organization	x8
Package	TFBGA (Thin Fine Pitch Ball Grid Array)	60 balls
Supply Voltage (Vcc)	Core Supply Voltage	3.3V ± 0.3V
Supply Voltage (Vccq)	I/O Supply Voltage	3.3V ± 0.3V
Clock Frequency	Maximum Clock Frequency	133 MHz
CAS Latency	Column Address Strobe Latency	CL=2
Operating Temperature	Commercial Operating Temperature Range	0°C to +70°C
Data Width	Data Bus Width	8 bits
Row Address Bits	Number of Row Address Bits	13
Column Address Bits	Number of Column Address Bits	9
Refresh Rate	Refresh Cycle Time	64ms (tREF)
Power Consumption	Active Power Consumption	350 mW typ.
Standby Power	Standby Power Consumption	50 mW typ.

Instructions for Use

1. Power Supply Connection: Ensure Vcc and Vccq are connected to a stable 3.3V power supply with appropriate decoupling capacitors close to the device.

2. Clock Signal: Provide a stable clock signal up to 133 MHz to the CLK pin. Ensure minimal jitter for reliable operation.

3. Initialization: After power-up, initialize the SDRAM by performing a Precharge All command followed by an Auto-Refresh cycle.

4. Mode Register Setting: Set the Mode Register according to your application needs using the MODE command. For MT48LC8M16A2TG-8E, set CAS Latency to 2.

5. Memory Access: Perform read/write operations ensuring proper timing parameters such as CAS latency, RAS-to-CAS delay, etc., are adhered to.

6. Refresh Management: Implement periodic refresh cycles every 64ms to maintain data integrity in the memory cells.

7. Power Management: Utilize low-power modes like self-refresh or power-down when not actively accessing memory to reduce power consumption.

8. Signal Integrity: Maintain good signal integrity on address, control, and data lines to avoid data corruption and ensure reliable operation at high speeds.

9. Decoupling Capacitors: Place decoupling capacitors close to the power pins to minimize noise and ensure stable operation.

10. Handling: Handle the device with care to avoid damage from electrostatic discharge (ESD). Use proper ESD protection measures during handling and assembly.

(For reference only)