Details

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BUY MC74ACT323N https://www.utsource.net/itm/p/12612376.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	Vcc	1.65	3.3	5.5	V
Output Voltage (High)	VOH	-	3.3	5.0	V	@ IOH = -0.4mA, Vcc = 5V
Output Voltage (Low)	VOL	0.0	0.1	0.4	V	@ IOL = 16mA, Vcc = 5V
Input Voltage (High)	VIH	2.0	-	5.5	V
Input Voltage (Low)	VIL	0.0	-	0.8	V
Input Leakage Current	II	-1	0	1	渭A
Output Leakage Current	IOL	-1	0	1	渭A
Propagation Delay Time	tpd	2.5	4.5	7	ns	@ Vcc = 5V, TA = 25掳C
Power Dissipation	PD	-	-	100	mW
Operating Temperature	Topr	-40	-	85	掳C
Storage Temperature	Tstg	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the specified range of 1.65V to 5.5V.
   • Avoid connecting the supply voltage in reverse to prevent damage.

2. Input and Output Voltages:

   • The input voltages (VIH and VIL) must be within the specified limits to ensure proper logic levels.
   • The output voltages (VOH and VOL) should be checked to ensure they meet the required levels for the connected circuit.

3. Current Handling:

   • The input leakage current (II) and output leakage current (IOL) are minimal but should be considered in sensitive circuits.
   • Ensure that the output current (IOL) does not exceed the maximum rating to avoid overheating or damage.

4. Propagation Delay:

   • The propagation delay time (tpd) is crucial for timing-sensitive applications. Ensure that the delay meets the requirements of your design.

5. Power Dissipation:

   • The power dissipation (PD) should not exceed 100mW to prevent overheating. Use appropriate heat sinking if necessary.

6. Temperature Ranges:

   • The operating temperature (Topr) should be between -40掳C and 85掳C.
   • The storage temperature (Tstg) should be between -65掳C and 150掳C.

7. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage the component.
   • Store the device in a dry, cool place within the specified storage temperature range.

8. Soldering:

   • Follow standard soldering procedures to ensure reliable connections. Avoid excessive heat during soldering to prevent damage.

9. Testing:

   • Test the device in a controlled environment to verify its functionality before integrating it into a larger system.

(For reference only)