Details

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BUY 952906AFLF https://www.utsource.net/itm/p/12612383.html

Parameter	Description
Part Number	952906AFLF
Type	Surface Mount Device (SMD)
Package	0805
Resistance	100 k惟 卤 1%
Power Rating	1/8 W (125 mW)
Voltage Rating	200 V
Tolerance	卤1%
Temperature Coefficient	100 ppm/掳C
Operating Temperature	-55掳C to +125掳C
Mounting Type	Surface Mount
Termination	SnPb (Lead-Free)
Compliance	RoHS Compliant

Instructions for Use:

1. Handling:

   • Handle with care to avoid damage to the component.
   • Use appropriate ESD (Electrostatic Discharge) protection measures.

2. Mounting:

   • Ensure the PCB (Printed Circuit Board) is clean and free from contaminants.
   • Apply solder paste to the pads using a stencil or syringe.
   • Place the resistor on the designated pads, ensuring proper alignment.
   • Use a reflow soldering process following the recommended temperature profile.

3. Soldering Profile:

   • Preheat: 120掳C to 150掳C for 60 to 120 seconds.
   • Soak: 180掳C to 200掳C for 60 to 90 seconds.
   • Reflow: Peak temperature of 230掳C to 250掳C for 10 to 20 seconds.
   • Cooling: Cool down to below 100掳C at a rate of 2掳C to 4掳C per second.

4. Inspection:

   • Visually inspect the solder joints for proper wetting and absence of voids or bridges.
   • Use X-ray inspection if necessary to ensure internal connections are intact.

5. Storage:

   • Store in a dry, cool place away from direct sunlight.
   • Use within the recommended storage period to ensure optimal performance.

6. Disposal:

   • Dispose of the component according to local environmental regulations.
   • Recycle where possible.

(For reference only)