EM68B16CWQK-25H

EM68B16CWQK-25H

Category: IC Chips

Specifications
Details

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Parameter Description Value Unit
Package Type Type of package BGA (Ball Grid Array) -
Pin Count Number of pins 16 -
Operating Temperature Range of temperature where the device can operate effectively -40 to +85 °C
Storage Temperature Range of temperature for storage -55 to +125 °C
Supply Voltage Voltage range for power supply 1.7 to 3.6 V
Clock Frequency Maximum clock frequency 25 MHz
Power Consumption Typical power consumption 1.5 mW/MHz
Data Retention Time Duration data is retained without power 10 years -
Memory Density Amount of memory 1 Mbit -
Organization Memory organization 128K x 8 -

Instructions for Use

  1. Power Supply: Ensure that the supply voltage is within the specified range of 1.7V to 3.6V. Exceeding this range can damage the component.

  2. Clock Configuration: Set up the clock to run at a maximum frequency of 25 MHz. Stable operation depends on accurate clock settings.

  3. Temperature Management: Operate and store the device within the specified temperature ranges to prevent thermal damage or degradation.

  4. Handling Precautions: Handle with care to avoid damage to the BGA package. Follow ESD (Electrostatic Discharge) precautions during handling and installation.

  5. Data Retention: The device retains data for up to 10 years without power. For longer periods, consider periodic power cycling if possible.

  6. Installation: Follow manufacturer guidelines for soldering and mounting the BGA package to ensure proper electrical connections and mechanical stability.

  7. Testing: After installation, perform initial tests to verify functionality under expected operating conditions.

(For reference only)

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