Details

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BUY FDD86110 https://www.utsource.net/itm/p/12612400.html

Parameter	Symbol	Test Conditions	Min	Typical	Max	Unit
Drain-Source Voltage	VDS	-	-	650	-	V
Gate-Source Voltage	VGS	-	-	卤20	-	V
Continuous Drain Current (TC=25掳C)	ID	VDS=650V, TC=25掳C	-	30	-	A
Continuous Drain Current (TC=100掳C)	ID	VDS=650V, TC=100掳C	-	18	-	A
Pulse Drain Current (tp=10渭s, Ipp/ID=2.5)	Ipp	VDS=650V, TC=25掳C	-	75	-	A
Total Power Dissipation (TC=25掳C)	PTOT	-	-	420	-	W
Total Power Dissipation (TC=100掳C)	PTOT	-	-	250	-	W
Junction Temperature	TJ	-	-	-	150	掳C
Storage Temperature Range	TSTG	-	-65	-	150	掳C
Gate Charge	QG	VGS=15V, ID=30A	-	160	-	nC
Input Capacitance	Ciss	VDS=650V, f=1MHz	-	3200	-	pF
Output Capacitance	Coss	VDS=650V, f=1MHz	-	150	-	pF
Reverse Transfer Capacitance	Crss	VDS=650V, f=1MHz	-	120	-	pF
Turn-On Delay Time	td(on)	VGS=15V, ID=30A	-	25	-	ns
Rise Time	tr	VGS=15V, ID=30A	-	35	-	ns
Turn-Off Delay Time	td(off)	VGS=15V, ID=30A	-	25	-	ns
Fall Time	tf	VGS=15V, ID=30A	-	35	-	ns
On-State Resistance	RDS(on)	VGS=15V, ID=30A, TC=25掳C	-	0.035	-	惟
On-State Resistance	RDS(on)	VGS=15V, ID=30A, TC=100掳C	-	0.055	-	惟

Instructions for Use:

1. Handling Precautions:

   • Avoid exposing the device to temperatures outside the specified operating range.
   • Use proper ESD protection when handling the device to prevent damage.

2. Mounting:

   • Ensure good thermal management by using appropriate heatsinks or cooling solutions.
   • Follow recommended PCB layout guidelines to minimize parasitic inductances and improve performance.

3. Biasing:

   • Apply gate-source voltage (V_GS) within the specified limits to avoid damaging the device.
   • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).

4. Operation:

   • Monitor the junction temperature (T_J) to ensure it does not exceed the maximum rating.
   • Operate the device within its safe operating area (SOA) to prevent thermal runaway and device failure.

5. Storage:

   • Store the device in a dry, cool place away from direct sunlight and extreme temperatures.
   • Keep the device in its original packaging until ready for use to protect against static discharge.

6. Testing:

   • Use appropriate test equipment and methods to measure parameters accurately.
   • Refer to the datasheet for specific test conditions and procedures.

7. Troubleshooting:

   • If the device fails to operate correctly, check for proper biasing, thermal management, and connections.
   • Consult the datasheet or contact the manufacturer for further assistance.

(For reference only)