Details

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BUY FT6122D. https://www.utsource.net/itm/p/12612408.html

Parameter	Description	Value
Part Number	Device Identifier	FT6122D
Function	Touch Controller	Capacitive Touch Screen
Interface	Communication Protocol	I2C, SPI
Operating Voltage	Supply Voltage Range	2.7V to 3.6V
Operating Current	Active Mode Current Consumption	1.2mA (Typical)
Standby Current	Standby Mode Current Consumption	0.5uA (Typical)
Operating Temperature	Temperature Range for Normal Operation	-40掳C to +85掳C
Touch Points	Maximum Number of Simultaneous Touches	2
Touch Sensitivity	Minimum Touch Force Required	10g
Response Time	Time to Detect and Report a Touch	< 8ms
Package Type	Physical Package	QFN-24
Dimensions	Package Size	4mm x 4mm
Pin Count	Number of Pins	24

Instructions

1. Power Supply:

   • Connect the VCC pin to a stable power supply within the operating voltage range (2.7V to 3.6V).
   • Connect the GND pin to the ground.

2. Communication Interface:

   • For I2C communication:
     • Connect SDA (Serial Data) and SCL (Serial Clock) pins to the corresponding I2C lines on the host microcontroller.
     • Ensure pull-up resistors (typically 4.7k惟) are connected to the SDA and SCL lines.
   • For SPI communication:
     • Connect MOSI (Master Out Slave In), MISO (Master In Slave Out), SCK (Serial Clock), and CS (Chip Select) pins to the corresponding SPI lines on the host microcontroller.

3. Reset Pin:

   • The RST pin can be used to reset the device. Pull it high to reset the device.

4. Interrupt Pin:

   • The INT pin is an active-low interrupt output. It can be used to signal the host when a touch event occurs.

5. Configuration:

   • Use the appropriate register settings to configure the touch sensitivity, debounce time, and other parameters. Refer to the datasheet for detailed register descriptions.

6. Firmware Update:

   • The FT6122D supports firmware updates via the I2C or SPI interface. Follow the firmware update procedure described in the datasheet.

7. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the IC.
   • Ensure that the device is not exposed to voltages outside the specified operating range.

8. Mounting:

   • Mount the device on a PCB using standard surface mount technology (SMT) processes.
   • Ensure proper thermal management if the device is expected to operate in high-temperature environments.

For more detailed information, refer to the official datasheet and application notes provided by the manufacturer.

(For reference only)