Details

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BUY TL783C. https://www.utsource.net/itm/p/12612409.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Output Voltage	VOUT	IADJ = 1.25mA, IL = 500mA	1.25	-	37	V
Line Regulation	ΔVOUT/ΔVIN	IL = 500mA, VIN = 3V to 40V	-	0.01	-	%/V
Load Regulation	ΔVOUT/ΔIL	VIN = 3V to 40V, IL = 0 to 500mA	-	0.1	-	%/A
Dropout Voltage	VDROP	IL = 500mA, VOUT = 1.25V	-	1.5	-	V
Quiescent Current	IQ	VIN = 3V to 40V, IL = 0mA	-	5	-	mA
Output Current	IOUT	VIN = 3V to 40V, VOUT = 1.25V	-	500	-	mA
Thermal Shutdown	TSD	-	-	160	-	°C
Short-Circuit Current	ISC	VIN = 3V to 40V, VOUT shorted to ground	-	1.5	-	A

Instructions for Use:

1. Power Supply:

   • Ensure the input voltage (V_IN) is within the specified range (3V to 40V).
   • The output voltage (V_OUT) can be adjusted from 1.25V to 37V.

2. Output Voltage Adjustment:

   • Use the formula V_OUT = 1.25V * (1 + R2/R1) + I_ADJ * R2 to set the desired output voltage, where R1 and R2 are the resistors connected between the output, adjustment, and ground pins.
   • I_ADJ is typically 50μA.

3. Capacitors:

   • Place a 1μF capacitor between the input pin and ground to stabilize the input voltage.
   • Optionally, place a 1μF capacitor between the output pin and ground to improve transient response and stability.

4. Thermal Considerations:

   • Ensure adequate heat dissipation if the device is operating at high output currents or high ambient temperatures.
   • The device will shut down if the junction temperature exceeds 160°C.

5. Short-Circuit Protection:

   • The device has internal short-circuit protection, but it is recommended to use external fuses or current-limiting resistors for additional safety.

6. Layout:

   • Keep the PCB layout compact to minimize noise and improve performance.
   • Use wide traces for power and ground connections to reduce resistance and voltage drops.

7. Storage and Handling:

   • Store the device in a dry environment and handle with care to avoid damage to the pins and internal components.

(For reference only)