Details
BUY 2SK2482 https://www.utsource.net/itm/p/12612418.html
| Parameter | Symbol | Value | Unit | Notes |
|---|---|---|---|---|
| Drain-Source Voltage | V(DS) | 200 | V | Maximum rating |
| Gate-Source Voltage | V(GS) | ±20 | V | Maximum rating |
| Drain Current | I(D) | 10 | A | Maximum continuous |
| Pulse Drain Current | I(DM) | 50 | A | Pulse width ≤ 300 μs |
| Power Dissipation | P(TOT) | 160 | W | Case temperature = 25°C |
| Junction Temperature | T(J) | -55 to 175 | °C | Operating range |
| Storage Temperature | T(STG) | -55 to 150 | °C | |
| Thermal Resistance | R(θJC) | 0.9 | °C/W | Junction to case |
Instructions for Use:
- Mounting: Ensure proper heat sinking when operating at high power levels to maintain junction temperature within specified limits.
- Voltage Handling: Do not exceed the maximum drain-source voltage (V(DS)) of 200V to prevent damage.
- Current Limitations: Continuous operation should not exceed 10A drain current. For pulse operations, up to 50A is permissible for pulse widths ≤ 300 μs.
- Temperature Management: Keep the junction temperature between -55°C and 175°C for reliable operation. Store in environments where temperatures do not fall below -55°C or rise above 150°C.
- Gate Protection: Protect the gate-source voltage from exceeding ±20V to avoid damaging the device.
- Thermal Consideration: Use the thermal resistance value to design appropriate cooling mechanisms, ensuring that the junction does not overheat under load.
View more about 2SK2482 on main site
