Details

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BUY BSC500N20NS3G https://www.utsource.net/itm/p/12612440.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Drain-Source Voltage	VDS	-200	-	-	V
Gate-Source Voltage	VGS	-20	-	20	V
Continuous Drain Current	ID	-	500	-	mA	@ TC = 25掳C
Pulse Drain Current	ID( pul )	-	1000	-	mA	tp = 10 渭s, IG = 10 A
Power Dissipation	PTOT	-	-	1000	mW	@ TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Thermal Resistance	R胃JC	-	62.5	-	K/W	Junction to Case
Gate Charge	QG	-	4.5	-	nC
Input Capacitance	Ciss	-	900	-	pF	@ VDS = 20 V, f = 1 MHz
Output Capacitance	Coss	-	250	-	pF	@ VDS = 20 V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	150	-	pF	@ VDS = 20 V, f = 1 MHz
Turn-On Delay Time	td(on)	-	18	-	ns	@ ID = 500 mA, VGS = 10 V
Rise Time	tr	-	12	-	ns	@ ID = 500 mA, VGS = 10 V
Turn-Off Delay Time	td(off)	-	22	-	ns	@ ID = 500 mA, VGS = 10 V
Fall Time	tf	-	15	-	ns	@ ID = 500 mA, VGS = 10 V

Instructions:

1. Operating Conditions:

   • Ensure that the drain-source voltage (V_DS) does not exceed 200V.
   • The gate-source voltage (V_GS) should be within the range of -20V to 20V.
   • The continuous drain current (I_D) should not exceed 500mA at a case temperature (T_C) of 25掳C.
   • For pulse conditions, the drain current (I_D(pul)) can reach up to 1000mA for a pulse duration (t_p) of 10 渭s with a gate current (I_G) of 10A.

2. Thermal Management:

   • The junction temperature (T_J) should not exceed 175掳C.
   • The storage temperature (T_STG) range is from -65掳C to 150掳C.
   • Use appropriate heat sinks or cooling methods to manage the power dissipation (P_TOT) and thermal resistance (R_胃JC).

3. Capacitance and Timing:

   • Consider the input capacitance (C_iss), output capacitance (C_oss), and reverse transfer capacitance (C_rss) when designing the circuit to ensure stability and performance.
   • The turn-on and turn-off times (t_d(on), t_r, t_d(off), t_f) should be taken into account to optimize switching performance and minimize switching losses.

4. Handling and Storage:

   • Handle the device with care to avoid damage to the leads and body.
   • Store the device in a dry, cool place within the specified storage temperature range.

5. Mounting:

   • Ensure proper mounting to the PCB to maintain good electrical and thermal connections.
   • Follow the recommended soldering profile to avoid thermal stress on the device.

6. Testing:

   • Test the device under controlled conditions to verify its performance and reliability.
   • Use appropriate test equipment and procedures to measure the parameters accurately.

(For reference only)