ADS131A04IPBS

ADS131A04IPBS

Category: IC Chips

Specifications
SKU
12612475
Details

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Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.7 - 5.5 V Operating supply voltage range
Supply Current IDD - 600 - μA Typical supply current at 3.3V, 1 kSPS
Analog Input Range VIN - - - V ±VREF/2 (single-ended), ±VREF (differential)
Reference Voltage VREF 1.65 - 4.096 V External reference input voltage range
Output Data Rate ODR 1 - 8 kSPS Output data rate range
Resolution RES - 24 - bits Effective resolution
INL INL - ±10 - LSB Integral nonlinearity
DNL DNL - ±1 - LSB Differential nonlinearity
SNR SNR - 110 - dB Signal-to-noise ratio at 1 kSPS
THD THD - -100 - dB Total harmonic distortion at 1 kSPS
Power-Down Mode Current IDD - 1 - μA Current consumption in power-down mode
Temperature Range Toper -40 - 85 °C Operating temperature range
Package - - - - 24-pin TSSOP Package type

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 2.7V to 5.5V.
    • Connect a decoupling capacitor (0.1μF) close to the VDD pin to filter out noise.
  2. Reference Voltage:

    • The external reference voltage (VREF) should be within the range of 1.65V to 4.096V.
    • For optimal performance, use a stable and low-noise reference source.
  3. Analog Inputs:

    • Single-ended inputs should be within the range of 0 to VREF.
    • Differential inputs should be within the range of -VREF to +VREF.
    • Ensure that the input signals do not exceed the specified limits to avoid damage or incorrect readings.
  4. Output Data Rate:

    • Set the output data rate (ODR) according to the application requirements, ranging from 1 kSPS to 8 kSPS.
    • Higher data rates may increase power consumption and reduce SNR.
  5. Configuration:

    • Use the configuration registers to set up the device parameters such as gain, input range, and data rate.
    • Refer to the datasheet for detailed register maps and configuration sequences.
  6. Communication:

    • The ADS131A04IPBS supports SPI communication. Ensure the SPI settings (clock speed, mode) are compatible with the device.
    • Properly manage the chip select (CS) signal to avoid data corruption.
  7. Power Management:

    • To reduce power consumption, use the power-down mode when the ADC is not in use.
    • Ensure the device is properly powered down and powered up to avoid transient issues.
  8. Temperature Considerations:

    • Operate the device within the specified temperature range of -40°C to 85°C.
    • Monitor the temperature and ensure adequate cooling if operating in high-temperature environments.
  9. Layout and Grounding:

    • Follow good PCB layout practices to minimize noise and interference.
    • Use a ground plane and keep analog and digital grounds separate to avoid ground loops.
  10. Testing and Validation:

    • After setup, perform initial testing to verify the functionality and accuracy of the ADC.
    • Calibrate the ADC if necessary to achieve the desired performance.

For more detailed information, refer to the specific datasheet and application notes provided by the manufacturer.

(For reference only)

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