Details

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BUY CY62126EV30LL-55ZSXE https://www.utsource.net/itm/p/12612483.html

Parameter	Description	Value
Device Type	High-Speed CMOS Static RAM	128K x 8
Package	TSOP II (44-Pin)	-
Operating Voltage	VCC	3.0V to 3.6V
Standby Current	Icc (VCC = 3.6V, Ta = 25°C)	1.0 μA (max)
Active Current	Icc (VCC = 3.6V, Ta = 25°C, f = 55 MHz)	25 mA (max)
Access Time	tAA (VCC = 3.6V, Ta = 25°C, f = 55 MHz)	55 ns (max)
Data Retention	tRET (VCC = 3.0V, Ta = 25°C)	20 years (min)
Temperature Range	Operating Temperature (Ta)	-40°C to +85°C
Storage Temperature	Storage Temperature (Tstg)	-65°C to +150°C
Input Voltage	VIH (High-Level Input Voltage)	2.0V to VCC
Input Voltage	VIL (Low-Level Input Voltage)	0V to 0.8V
Output Voltage	VOH (High-Level Output Voltage)	VCC - 0.4V (min)
Output Voltage	VOL (Low-Level Output Voltage)	0.4V (max)
Write Cycle Time	tCYC (VCC = 3.6V, Ta = 25°C, f = 55 MHz)	70 ns (max)
Output Enable Time	tOE (VCC = 3.6V, Ta = 25°C, f = 55 MHz)	15 ns (max)
Output Disable Time	tOH (VCC = 3.6V, Ta = 25°C, f = 55 MHz)	15 ns (max)
Clock Skew	tCKS (VCC = 3.6V, Ta = 25°C, f = 55 MHz)	5 ns (max)
Power-down Mode	Power-down Current (VCC = 3.6V, Ta = 25°C)	0.1 μA (max)
Endurance	Write Cycles	Unlimited
Data Integrity	Data Retention at End of Life	20 years (min)

Instructions for Use:

1. Power Supply:

   • Ensure that the operating voltage (VCC) is within the specified range of 3.0V to 3.6V.
   • Use appropriate decoupling capacitors (e.g., 0.1 μF ceramic capacitors) close to the power pins to minimize noise.

2. Signal Timing:

   • Ensure that all timing parameters, such as access time (tAA), write cycle time (tCYC), and output enable/disable times (tOE, tOH), are met to avoid data corruption or incorrect operation.
   • Use a stable clock source with minimal skew (tCKS).

3. Temperature Considerations:

   • Operate the device within the specified temperature range of -40°C to +85°C to ensure reliable performance.
   • Store the device in a temperature range of -65°C to +150°C when not in use.

4. Power Management:

   • To reduce power consumption, use the power-down mode by setting the chip enable (CE) and output enable (OE) pins high.
   • The power-down current should be less than 0.1 μA.

5. Data Integrity:

   • The device has unlimited write cycles and a data retention period of at least 20 years under normal operating conditions.

6. Handling and Storage:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage.
   • Store the device in a dry environment to prevent moisture-related issues.

7. Mounting and Soldering:

   • Follow recommended soldering profiles and temperatures to ensure proper mounting on the PCB.
   • Avoid excessive heat during soldering to prevent damage to the device.

8. Testing and Validation:

   • Perform thorough testing and validation to ensure that the device meets all functional and performance requirements in the target application.

(For reference only)