Details

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BUY LT3092ITS8#TRMPBF https://www.utsource.net/itm/p/12612488.html

Parameter	Symbol	Min	Typical	Max	Unit
Input Voltage	VIN	2.9	-	45	V
Output Current	IOUT	0	-	200	mA
Quiescent Current	IQ	-	50	-	μA
Dropout Voltage	VDROPOUT	-	300	-	mV (IOUT = 100mA)
Power Supply Rejection Ratio	PSRR	-	70	-	dB (f = 120Hz)
Operating Temperature	TOPR	-40	-	125	°C
Storage Temperature	TSTG	-65	-	150	°C
Junction Temperature	TJ	-	-	150	°C

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 2.9V to 45V.
   • The device is designed to operate with a wide range of input voltages, making it suitable for various power supply applications.

2. Output Current (IOUT):

   • The device can provide a continuous output current up to 200mA.
   • For optimal performance, ensure the load does not exceed this limit.

3. Quiescent Current (IQ):

   • The quiescent current is typically 50μA, which is relatively low, making the device suitable for battery-powered applications where power consumption needs to be minimized.

4. Dropout Voltage (VDROPOUT):

   • The dropout voltage is typically 300mV at an output current of 100mA.
   • This low dropout voltage allows the device to maintain regulation even when the input voltage is close to the output voltage.

5. Power Supply Rejection Ratio (PSRR):

   • The PSRR is typically 70dB at a frequency of 120Hz.
   • This high PSRR helps in filtering out noise from the input power supply, ensuring a clean output voltage.

6. Operating Temperature (TOPR):

   • The device is designed to operate over a temperature range of -40°C to 125°C.
   • Ensure that the ambient temperature and any heat dissipation mechanisms are considered to keep the device within this range.

7. Storage Temperature (TSTG):

   • The device can be stored at temperatures ranging from -65°C to 150°C.
   • Store the device in a dry environment to prevent moisture damage.

8. Junction Temperature (TJ):

   • The maximum junction temperature is 150°C.
   • Proper heat sinking or cooling mechanisms should be used to prevent the junction temperature from exceeding this limit, especially under high load conditions.

Additional Notes:

• PCB Layout:
  • Ensure proper PCB layout to minimize parasitic inductance and capacitance, which can affect the stability and performance of the device.
• Capacitors:
  • Use high-quality capacitors for input and output filtering to maintain stability and reduce ripple.
• Thermal Management:
  • If operating at high currents or in high ambient temperatures, consider using a heatsink or other thermal management techniques to keep the device within its operating temperature range.

(For reference only)