Details

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BUY K4S511632C-KC75 https://www.utsource.net/itm/p/12615040.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	2.7	-	3.6	V	Operating voltage range
Standby Current	ISB	-	0.1	-	渭A	Current consumption in standby mode
Active Current	IOP	-	10	-	mA	Current consumption in active mode
Access Time	tAC	-	25	-	ns	Access time from chip select to output valid
Cycle Time	tCY	-	35	-	ns	Minimum cycle time for read or write operations
Write Recovery Time	tWR	-	20	-	ns	Time required after write to ensure data integrity
Data Hold Time	tDH	-	5	-	ns	Time data must be held after the falling edge of the write enable signal
Address Setup Time	tAS	-	15	-	ns	Time address must be stable before the falling edge of the chip select
Output Enable Setup Time	tOE	-	10	-	ns	Time output enable must be stable before the falling edge of the chip select
Output Disable Time	tOH	-	10	-	ns	Time output disable must be stable after the rising edge of the output enable
Data Output Delay	tDO	-	10	-	ns	Delay from the falling edge of the chip select to the first valid data output
Power-down Mode	PD	-	-	-	-	Enters power-down mode when both chip select and output enable are high

Instructions:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 2.7V to 3.6V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Signal Timing:

   • Follow the timing parameters for address setup (tAS), access time (tAC), and cycle time (tCY) to ensure reliable operation.
   • Ensure that the write recovery time (tWR) and data hold time (tDH) are met during write operations.

3. Output Control:

   • Use the output enable (OE) signal to control data output.
   • Ensure the output enable setup time (tOE) and output disable time (tOH) are respected.

4. Power Management:

   • To enter power-down mode, set both the chip select (CS) and output enable (OE) signals high.
   • The device will consume minimal current in this mode.

5. Data Integrity:

   • Ensure that the data output delay (tDO) is considered when reading data from the device.

6. Storage and Handling:

   • Store the device in a dry, static-free environment.
   • Handle with care to avoid damage to the pins and internal components.

(For reference only)